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不同冷却速率凝固的锰合金锡银铜焊料力学性能研究

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates.

作者信息

Hurtony Tamás, Krammer Oliver, Illés Balázs, Harsányi Gábor, Bušek David, Dušek Karel

机构信息

Department of Electronics Technology, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, 1111 Budapest, Hungary.

Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, 166 36 Prague 6, Czech Republic.

出版信息

Materials (Basel). 2020 Nov 20;13(22):5251. doi: 10.3390/ma13225251.

DOI:10.3390/ma13225251
PMID:33233687
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7699749/
Abstract

Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s. After measuring the shear force and the Vickers hardness, the structures of the fracture surfaces and the intermetallic layer were investigated by SEM (Scanning Electron Microscopy). The mechanical property measurements showed lower shear force for the SAC0307-Mn07 alloy (20-25 N) compared with the SAC305 alloy (27-35 N), independent of the cooling rate. However, the SAC0307-Mn07 alloy was softer; its Vickers hardness was between 12 and 13 HV, whereas the Vickers hardness of the SAC305 alloy was between 19 and 20 HV. In addition, structural analyses revealed rougher intermetallic compound layers in the case of the SAC0307-Mn07 alloy, which can inhibit the propagation of cracks at the solder-substrate interface. These two properties of SAC0307-Mn07 alloy, the softer nature and the rougher intermetallic layer, might result in better thermomechanical behavior of the solder joints during the lifetime of electronic devices.

摘要

由于锰价格低廉且性质无害，它可以成为无铅SAC（锡银铜）焊料合金中的一种理想合金添加剂。在本研究中，通过分析回流焊球的剪切力和维氏硬度，研究了添加0.7 wt.% 锰的新型SAC0307（锡/银0.3/铜0.7）合金（命名为SAC0307-Mn07）以及传统使用的SAC305（锡96.5/银3/铜0.5）焊料合金的机械性能。在制备回流焊球过程中，使用了2.7 K/s至14.7 K/s范围内的不同冷却速率。在测量剪切力和维氏硬度之后，通过扫描电子显微镜（SEM）研究了断裂表面和金属间化合物层的结构。机械性能测量结果表明，与SAC305合金（27 - 35 N）相比，SAC0307-Mn07合金的剪切力较低（20 - 25 N），且与冷却速率无关。然而，SAC0307-Mn07合金更软；其维氏硬度在12至13 HV之间，而SAC305合金的维氏硬度在19至20 HV之间。此外，结构分析表明，SAC0307-Mn07合金的金属间化合物层更粗糙，这可以抑制焊料与基板界面处裂纹的扩展。SAC0307-Mn07合金的这两种特性，即更软的性质和更粗糙的金属间层，可能会导致电子设备使用寿命期间焊点具有更好的热机械性能。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a678/7699749/d6825d74121f/materials-13-05251-g012.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a678/7699749/16a32654e371/materials-13-05251-g008.jpg
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