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一种用于增强3D打印基板上气溶胶喷射印刷电路性能的后处理方法。

A Post-Treatment Method to Enhance the Property of Aerosol Jet Printed Electric Circuit on 3D Printed Substrate.

作者信息

Wang Bing, Zhang Haining, Choi Joon Phil, Moon Seung Ki, Lee Byunghoon, Koo Jamyeong

机构信息

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore.

Strong-Field and Ultrafast Photonics Lab, Key Laboratory of Trans-Scale Laser Manufacturing Technology, Ministry of Education, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China.

出版信息

Materials (Basel). 2020 Dec 8;13(24):5602. doi: 10.3390/ma13245602.

Abstract

Aerosol jet printing of electronic devices is increasingly attracting interest in recent years. However, low capability and high resistance are still limitations of the printed electronic devices. In this paper, we introduce a novel post-treatment method to achieve a high-performance electric circuit. The electric circuit was printed with aerosol jet printing method on an ULTEM substrate. The ULTEM substrate was fabricated by the Fused Deposition Modelling method. After post-treatment, the electrical resistance of the printed electric circuit was changed from 236 mΩ to 47 mΩ and the electric property was enhanced. It was found that the reduction of electric resistance was caused by surface property changes. Different surface analysis methods including scanning electron microscopy (SEM) and x-ray photoelectron spectroscopy (XPS) were used to understand the effectiveness of the proposed method. The results showed that the microsurface structure remained the same original structure before and after treatment. It was found that the surface carbon concentration was significantly increased after treatment. Detailed analysis showed that the C-C bond increased obviously after treatment. The change of electrical resistance was found to be limited to the material's surface. After polishing, the circuit resistance was changed back to its original value. As the electric circuit is the basic element of electric devices, the proposed method enables the fabrication of high performance devices such as capacitors, strain gauge, and other sensors, which has potential applications in many areas such as industrial, aerospace, and military usage.

摘要

近年来,电子器件的气溶胶喷射印刷越来越受到关注。然而,低性能和高电阻仍然是印刷电子器件的局限性。在本文中,我们介绍了一种新颖的后处理方法来实现高性能电路。该电路采用气溶胶喷射印刷方法印刷在ULTEM基板上。ULTEM基板是通过熔融沉积建模方法制造的。经过后处理,印刷电路的电阻从236 mΩ变为47 mΩ,电学性能得到增强。发现电阻的降低是由表面性质变化引起的。使用包括扫描电子显微镜(SEM)和X射线光电子能谱(XPS)在内的不同表面分析方法来了解所提出方法的有效性。结果表明,微表面结构在处理前后保持相同的原始结构。发现处理后表面碳浓度显著增加。详细分析表明,处理后C-C键明显增加。发现电阻的变化仅限于材料表面。抛光后,电路电阻恢复到其原始值。由于电路是电子器件的基本元件,所提出的方法能够制造诸如电容器、应变计和其他传感器等高性能器件,这在工业、航空航天和军事应用等许多领域具有潜在应用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3930/7763611/0c311245a1d5/materials-13-05602-g001.jpg

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