Luo Chuan, Wang Han, Zhang Dacheng, Zhao Zhengang, Li Yingna, Li Chuan, Liang Ke
Faculty of Information Engineering and Automation, Kunming University of Science and Technology, Kunming 650500, China.
Yunnan Key Laboratory of Computer Technology Applications, Kunming University of Science and Technology, Kunming 650500, China.
Micromachines (Basel). 2020 Dec 26;12(1):16. doi: 10.3390/mi12010016.
A double-thimble-type fiber Bragg grating (FBG) temperature sensor that isolates the stress strain is developed, and the three materials of air, grease, and copper thimble are employed for encapsulating. To investigate the effect of different encapsulation materials on the time constant of the sensors under dynamic conditions, the transient heat conduction mathematical model is built according to the lumped heat capacity (LHC) system and thermal equilibrium theory, and the time constant is solved by an analytical solution. Then, a proportional three-dimensional sensor simulation model is established and the transient heat transfer process is numerically solved by the finite element analysis method. To verify the models, an experimental system is established to test the response speed of the three-type sensor and the experimental data are compared with the analytical and numerical solution results. The results show that the dynamic response performance depends on the encapsulation material parameters; the response speed is faster than recovery speed; and the response speed of the air packaging sensor is more than 20% faster than that of the grease packaging sensor, and more than 30% faster than that of the copper packaging sensor. The smaller the heat storage capacity and the larger the heat transfer coefficient, the faster the sensor's response speed.
研制了一种隔离应力应变的双套管式光纤布拉格光栅(FBG)温度传感器,并采用空气、油脂和铜套管三种材料进行封装。为研究不同封装材料对动态条件下传感器时间常数的影响,根据集总热容(LHC)系统和热平衡理论建立了瞬态热传导数学模型,并通过解析解求解时间常数。然后,建立了比例三维传感器仿真模型,并采用有限元分析方法对瞬态传热过程进行了数值求解。为验证模型,建立了实验系统来测试三种类型传感器的响应速度,并将实验数据与解析解和数值解结果进行了比较。结果表明,动态响应性能取决于封装材料参数;响应速度比恢复速度快;空气封装传感器的响应速度比油脂封装传感器快20%以上,比铜封装传感器快30%以上。蓄热能力越小,传热系数越大,传感器的响应速度越快。