Luo Dan, Xiao Yong, Hardwick Liam, Snell Robert, Way Matthew, Sanuy Morell Xavier, Livera Frances, Ludford Nicholas, Panwisawas Chinnapat, Dong Hongbiao, Goodall Russell
Department of Materials Science and Engineering, The University of Sheffield, Sir Robert Hadfield Building, Mappin St, Sheffield S1 3JD, UK.
School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China.
Entropy (Basel). 2021 Jan 7;23(1):78. doi: 10.3390/e23010078.
In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.
在寻找基于高熵合金（HEA）型材料理念开发的合金应用时，关注点可能会放在当前合金也使用多种成分的应用上，尽管其成分含量低于高熵合金中的含量。已经发现具有复杂成分合金的一个领域是用于连接的填充金属。在软钎焊（<450°C）和硬钎焊（>450°C）中，填充金属合金被加热到其液相线温度以上，并用于在两个部件之间形成金属键，这两个部件在整个过程中保持未熔化且基本不变。这些连接方法广泛应用于从电子到航空航天和能源等领域，填充金属种类繁多，以实现与多种基材的兼容性（包括将陶瓷与金属连接的能力）以及适应大范围的加工温度。在此，我们综述了与高熵材料相关的填充金属的最新进展，并认为此类合金值得进一步探索，以帮助克服基于填充金属的连接方法当前需要解决的一些挑战。
