Gao Zeng, Ba Xianli, Yang Huanyu, Yin Congxin, Liu Shanguang, Niu Jitai, Brnic Josip
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China.
Beijing Institute of Aeronautical Materials, Beijing 100095, China.
Materials (Basel). 2020 Jul 2;13(13):2965. doi: 10.3390/ma13132965.
The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Si/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and AlTi. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10 Pa·m/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi) intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Si/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Si/Al MMCs. The micro-crack propagated not only Ti(AlSi), but also the Si particles in the substrate.
对异种电子封装材料的真空钎焊进行了研究。在本研究中，将硅颗粒增强铝基复合材料（Si/Al MMCs）应用于可伐合金。在不同的连接温度和时间下，采用活性快淬薄带作为钎料。结果表明，当使用Al-7.5Si-23.0Cu-2.0Ni-1.0Ti作为钎料在580℃下钎焊30分钟时，接头的最大剪切强度达到96.62MPa。接头的X射线衍射（XRD）分析表明，主要相由Al、Si和金属间化合物组成，包括CuAl、TiFeSi、TiNiSi和AlTi。当钎焊温度在570℃至590℃范围内时，接头的泄漏率保持在10Pa·m/s或更低。当使用Al-7.5Si-23.0Cu-2.0Ni-2.5Ti作为钎料在580℃下钎焊30分钟时，钎料中较高的Ti含量导致在焊缝与Si/Al MMCs的界面处形成平均尺寸为7μm的片状Ti(AlSi)金属间相。接头断裂一般为准解理断裂形式，主要发生在钎料与Si/Al MMCs的界面处。微裂纹不仅在Ti(AlSi)中扩展，也在基体中的Si颗粒中扩展。
