Bagegni Aimen, Zabler Simon, Nelson Katja, Rack Alexander, Spies Benedikt C, Vach Kirstin, Kohal Ralf
Medical Center - University of Freiburg, Center for Dental Medicine, Department of Prosthetic Dentistry, Faculty of Medicine - University of Freiburg, Freiburg, Germany.
Lehrstuhl für Röntgenmikroskopie der Universität Würzburg, Josef-Martin-Weg 63 Hubland Nord, 97074 Würzburg, Germany.
J Mech Behav Biomed Mater. 2021 Apr;116:104330. doi: 10.1016/j.jmbbm.2021.104330. Epub 2021 Jan 23.
This study evaluates the effect of dynamic-loading on the microgap of the IAC when different supratructure heights are applied.
Forty-eight dental implants (24 each of butt-joint (H) and internal-conical connections (C)) were tested in this study. Each group was further divided into three groups (n = 8) according to the applied suprastructure height (H1, C1: 10 mm, H2, C2: 14 mm and H3, C3: 18 mm). All specimens were subjected to cyclic loading in a chewing-simulator with a load of 98 N for 5 × 10 chewing cycles. The microgap at the IAC was inspected before and after loading, using synchrotron-based micro computed tomography (SRμCT) and light microscopy (LM).
SRμCT revealed an internal microgap range between 0.26 μm and 0.5 μm in the group C, whereas the group H exhibited a microgap range between 0.26 μm and 0.47 μm prior to loading. After chewing simulation, a smaller microgap size in all groups was detected ranging from 0.11 μm to 0.26 μm (group C: 0.11μm-0.26 μm; group H: 0.21μm-0.25 μm). The LM investigation showed mean microgap values at the outer IAC junction before loading from 5.8 μm to 11.3 μm and from 3.9 μm to 7.2 μm after loading. All specimens exhibited a vertical intrusion displacement of the abutment.
Regardless of the crown height, the microgap between the abutment and implant systematically decreased after loading in both butt-joint and internal-conical connections.
本研究评估在应用不同上部结构高度时,动态加载对种植体-基台界面(IAC)微间隙的影响。
本研究测试了48颗牙种植体(对接型(H)和内锥连接型(C)各24颗)。根据应用的上部结构高度,每组进一步分为三组(n = 8)(H1、C1:10 mm,H2、C2:14 mm,H3、C3:18 mm)。所有标本在咀嚼模拟器中以98 N的载荷进行5×10⁴次咀嚼循环的循环加载。在加载前后,使用基于同步加速器的微观计算机断层扫描(SRμCT)和光学显微镜(LM)检查IAC处的微间隙。
SRμCT显示,C组内部微间隙范围在0.26μm至0.5μm之间,而H组在加载前微间隙范围在0.26μm至0.47μm之间。咀嚼模拟后,所有组的微间隙尺寸均减小,范围为0.11μm至0.26μm(C组:0.11μm - 0.26μm;H组:0.21μm - 0.25μm)。LM研究显示,加载前IAC外连接点处的平均微间隙值为5.8μm至11.3μm,加载后为3.9μm至7.2μm。所有标本均表现出基台的垂直侵入位移。
无论冠高度如何,对接型和内锥连接型在加载后基台与种植体之间的微间隙均系统性减小。