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用于减少电容式微机械超声换能器(CMUT)阵列中声学串扰的二氧化硅气凝胶研究。

An Investigation of Silica Aerogel to Reduce Acoustic Crosstalk in CMUT Arrays.

作者信息

Yashvanth Varshitha, Chowdhury Sazzadur

机构信息

Electrical and Computer Engineering Department, University of Windsor, Windsor, ON N9B 3P4, Canada.

出版信息

Sensors (Basel). 2021 Feb 19;21(4):1459. doi: 10.3390/s21041459.

Abstract

This paper presents a novel technique to reduce acoustic crosstalk in capacitive micromachined ultrasonic transducer (CMUT) arrays. The technique involves fabricating a thin layer of diisocyanate enhanced silica aerogel on the top surface of a CMUT array. The silica aerogel layer introduces a highly nanoporous permeable layer to reduce the intensity of the Scholte wave at the CMUT-fluid interface. 3D finite element analysis (FEA) simulation in COMSOL shows that the developed technique can provide a 31.5% improvement in crosstalk reduction for the first neighboring element in a 7.5 MHz CMUT array. The average improvement of crosstalk level over the -6 dB fractional bandwidth was 22.1%, which is approximately 5 dB lower than that without an aerogel layer. The results are in excellent agreement with published experimental results to validate the efficacy of the new technique.

摘要

本文提出了一种减少电容式微机械超声换能器(CMUT)阵列中声学串扰的新技术。该技术包括在CMUT阵列的顶表面上制造一层二异氰酸酯增强的二氧化硅气凝胶薄层。二氧化硅气凝胶层引入了一个高度纳米多孔的渗透层,以降低CMUT-流体界面处的肖尔特波强度。COMSOL中的三维有限元分析(FEA)模拟表明,所开发的技术可以使7.5 MHz的CMUT阵列中相邻第一个元件的串扰降低31.5%。在-6 dB分数带宽上,串扰水平的平均改善为22.1%,比没有气凝胶层时大约低5 dB。结果与已发表的实验结果高度吻合,验证了新技术的有效性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/48de/7922470/9d206d249dfd/sensors-21-01459-g001.jpg

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