Choi Hyun-Seok, Suh Su-Jeong, Kim Sang-Woo, Kim Hyun-Joong, Park Ji-Won
Advanced Materials Science and Engineering, SungKyunKwan University, Suwon-si, Gyeonggi-do 16419, Korea.
Clean Energy Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea.
Polymers (Basel). 2021 Feb 27;13(5):738. doi: 10.3390/polym13050738.
Utilization of methods involving component integration has accelerated, owing to the growth of the smart mobile industry. However, this integration leads to interference issues between the components, thereby elucidating the importance of the electromagnetic interference (EMI) shielding technology to solve such issues. EMI shielding technology has been previously implemented via the reflection or absorption of electromagnetic waves by using conductive materials. Nevertheless, to tackle the recent changes in the industry, a transparent and flexible EMI shielding technology is necessitated. In this study, a transparent and flexible EMI shielding material was fabricated by filling a conductive binder in a film comprising an intaglio pattern; this was achieved by using the ultraviolet (UV) imprinting technology to realize mass production. Subsequently, changes in the aperture ratio and shielding characteristics were analyzed according to the structure of the pattern. Based on this analysis, a square pattern was designed and a film with an intaglio pattern was developed through a UV imprinting process. Furthermore, it was confirmed that the transmittance, conductivity, and EMI shielding rate of the film were altered while changing the coating thickness of the conductive particles in the intaglio pattern. The final film prepared in this study exhibited characteristics that satisfied the required EMI shielding performance for electric and electronic applications, while achieving flexible structural stability and transparency.
由于智能移动行业的发展，涉及组件集成的方法的应用加速了。然而，这种集成会导致组件之间的干扰问题，从而阐明了电磁干扰（EMI）屏蔽技术解决此类问题的重要性。EMI屏蔽技术以前是通过使用导电材料对电磁波进行反射或吸收来实现的。然而，为了应对行业的最新变化，需要一种透明且灵活的EMI屏蔽技术。在本研究中，通过在包含凹版图案的薄膜中填充导电粘合剂来制造一种透明且灵活的EMI屏蔽材料；这是通过使用紫外线（UV）压印技术来实现大规模生产的。随后，根据图案的结构分析了孔径比和屏蔽特性的变化。基于此分析，设计了一种方形图案，并通过UV压印工艺开发了一种具有凹版图案的薄膜。此外，证实了在改变凹版图案中导电颗粒的涂层厚度时，薄膜的透光率、导电性和EMI屏蔽率会发生变化。本研究中制备的最终薄膜表现出满足电气和电子应用所需EMI屏蔽性能的特性，同时实现了灵活的结构稳定性和透明度。
