Choi Hyun-Seok, Park Ji-Won, Lee Kyung-Sub, Kim Sang-Woo, Suh Su-Jeong
Advanced Materials Science and Engineering, Sung Kyun Kwan University, Suwon 16419, Korea.
R&D Center, SMT Co., Ltd., Suwon 16643, Korea.
Polymers (Basel). 2020 Oct 10;12(10):2318. doi: 10.3390/polym12102318.
This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core-shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m K, and a -4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield's packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and AlO ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure.
本文提出了一种双功能片材（DFS），其同时具有高导热率（TC）和电磁干扰（EMI）吸收特性，使其适用于移动电子产品。通过采用一种简单但高效的干法制造核壳结构填料（CSSF）并配制紧密堆积的填料组合物，DFS表现出高性能，导热率为5.1 W m K，在1 GHz频率下的去耦比（IDR）为-4 dB。特别是，DFS表现出3 kV mm的高介电击穿电压（BDV），这有利于在大多数电子设备中应用。DFS由两种根据紧密堆积规则、霍斯菲尔德堆积模型混合的CSSF以及聚二甲基硅氧烷（PDMS）聚合物组成。核心材料是不同尺寸的软磁Fe-12.5%Cr和Fe-6.5%Si合金粉末，直径为1μm的AlO陶瓷粉末用作壳材料。DFS的高性能应该源于厚且稳定的壳层以及由于紧密堆积结构而实现的最大填料填充能力。
