Oh Bok-Hyun, Jung Choong-Hwan, Kong Heon, Lee Sang-Jin
Department of Advanced Materials Science and Engineering, Mokpo National University, Muan 58554, Republic of Korea.
Nuclear Materials Research Division, Korea Atomic Energy Research Institute, Daejeon 34057, Republic of Korea.
J Nanosci Nanotechnol. 2021 Sep 1;21(9):4964-4967. doi: 10.1166/jnn.2021.19262.
A Cu metal-ceramic filter composite with high thermal conductivity and a suitable thermal expansion coefficient was designed to be applied to high performance heat dissipation materials. The purpose of using the ceramic filler was to decrease the high coefficient of thermal expansion of Cu matrix utilizing the high thermal conductivity of Cu. In this study, a SiC ceramic filler powder was added to the Cu sol including Zn as a liquid phase sintering agent. The final complex was produced by applying a PVB polymer to prepare a homogeneous precursor followed by sintering in a reducing atmosphere. The pressureless sintered composite showed lower thermal conductivity than pure bulk Cu due to the some residual pores. In the case of the Cu-SiC composite in which 10 wt% of SiC filler was added, it showed a thermal conductivity of 100 W/m·°C and a thermal expansion coefficient of 13.3×10/°C. The thermal conductivity showed some difference from the theoretical calculated value due to the pores in the composite, but the thermal expansion coefficient did not show a significant difference.
设计了一种具有高导热率和合适热膨胀系数的铜基金属陶瓷过滤复合材料，用于高性能散热材料。使用陶瓷填料的目的是利用铜的高导热率来降低铜基体的高热膨胀系数。在本研究中，将碳化硅陶瓷填料粉末添加到含有锌作为液相烧结剂的铜溶胶中。通过施加聚乙烯醇缩丁醛聚合物制备均匀的前驱体，然后在还原气氛中烧结，得到最终的复合材料。由于存在一些残余孔隙，无压烧结复合材料的导热率低于纯块状铜。在添加了10 wt%碳化硅填料的铜-碳化硅复合材料中，其导热率为100 W/m·°C，热膨胀系数为13.3×10⁻⁶/°C。由于复合材料中的孔隙，导热率与理论计算值存在一些差异，但热膨胀系数没有显著差异。
