Department of Electrical Engineering, Korea University, Anam-ro 145, Seongbuk-gu, Seoul 02841, Republic of Korea.
J Nanosci Nanotechnol. 2021 Aug 1;21(8):4462-4465. doi: 10.1166/jnn.2021.19429.
In this study, we investigated thermoelectric materials with durability against mechanical stress using Ag₂Se nanoparticle (NP) thin films and colorless polyimide (CPI) substrates. Ag₂Se NP thin films and CPI substrates were produced by spin-coating, and their thicknesses were 40 nm and 15 m, respectively. A bendable thermoelectric film with a channel length of 40 m and a channel area of 1.6 m² generated a Seebeck voltage of 1.43 mV at a temperature difference of 4.5 K. Owing to the thickness of the extremely thin thermoelectric film and substrate, the mechanical strain was only 0.15% even when the thermoelectric devices were bent with a curvature of 3 mm. Therefore, it was determined that the bendable thermoelectric film was robust against mechanical stress.
在这项研究中，我们使用 Ag₂Se 纳米颗粒 (NP) 薄膜和无色聚酰亚胺 (CPI) 基板研究了具有机械应力耐久性的热电材料。Ag₂Se NP 薄膜和 CPI 基板通过旋涂法制备，其厚度分别为 40nm 和 15μm。具有 40μm 沟道长度和 1.6m² 沟道面积的可弯曲热电薄膜在 4.5K 的温差下产生 1.43mV 的塞贝克电压。由于极薄的热电薄膜和基板的厚度，即使热电器件弯曲曲率为 3mm，机械应变也仅为 0.15%。因此，确定可弯曲的热电薄膜具有很强的机械应力耐受性。
