Woo Seunghui, Nam Donghyeon, Chang Woojae, Ko Younji, Lee Seokmin, Song Yongkwon, Yeom Bongjun, Moon Jun Hyuk, Lee Seung Woo, Cho Jinhan
Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea.
Department of Chemical Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul, 04763, Republic of Korea.
Small. 2021 May;17(19):e2007579. doi: 10.1002/smll.202007579. Epub 2021 Mar 18.
Electrical conductivity, mechanical flexibility, and large electroactive surface areas are the most important factors in determining the performance of various flexible electrodes in energy storage devices. Herein, a layer-by-layer (LbL) assembly-induced metal electrodeposition approach is introduced to prepare a variety of highly porous 3D-current collectors with high flexibility, metallic conductivity, and large surface area. In this study, a few metal nanoparticle (NP) layers are LbL-assembled onto insulating paper for the preparation of conductive paper. Subsequent Ni electroplating of the metal NP-coated substrates reduces the sheet resistance from ≈10 to <0.1 Ω sq while maintaining the porous structure of the pristine paper. Particularly, this approach is completely compatible with commercial electroplating processes, and thus can be directly extended to electroplating applications using a variety of other metals in addition to Ni. After depositing high-energy MnO NPs onto Ni-electroplated papers, the areal capacitance increases from 68 to 811 mF cm as the mass loading of MnO NPs increases from 0.16 to 4.31 mg cm . When metal NPs are periodically LbL-assembled with the MnO NPs, the areal capacitance increases to 1710 mF cm .
电导率、机械柔韧性和大的电活性表面积是决定储能设备中各种柔性电极性能的最重要因素。在此,引入一种逐层(LbL)组装诱导金属电沉积方法来制备具有高柔韧性、金属导电性和大表面积的各种高度多孔的三维集流体。在本研究中,将几层金属纳米颗粒(NP)逐层组装到绝缘纸上以制备导电纸。随后对涂覆有金属NP的基材进行镍电镀,可将表面电阻从约10Ω/sq降低至<0.1Ω/sq,同时保持原始纸张的多孔结构。特别地,这种方法与商业电镀工艺完全兼容,因此除了镍之外,还可以直接扩展到使用各种其他金属的电镀应用。在将高能MnO NP沉积到镀镍纸上后,随着MnO NP的质量负载从0.16mg/cm增加到4.31mg/cm,面积电容从68mF/cm增加到811mF/cm。当金属NP与MnO NP周期性地逐层组装时,面积电容增加到1710mF/cm。