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通过调整超细铜纳米颗粒中Cu⁺/Cu⁰的比例来促进氢化反应

Ti Tuning the Ratio of Cu /Cu in the Ultrafine Cu Nanoparticles for Boosting the Hydrogenation Reaction.

作者信息

Zhang Ziyang, Wang Zhong-Li, An Kang, Wang Jiaming, Zhang Siran, Song Pengfei, Bando Yoshio, Yamauchi Yusuke, Liu Yuan

机构信息

Tianjin Key Laboratory of Applied Catalysis Science and Technology, School of Chemical Engineering and Technology, Tianjin University, Tianjin, 300072, China.

Institute of Molecular Plus, Tianjin University, Tianjin, 300072, China.

出版信息

Small. 2021 Jun;17(23):e2008052. doi: 10.1002/smll.202008052. Epub 2021 Apr 22.

Abstract

Hydrogenation of diesters to diols is a vital process for chemical industry. The inexpensive Cu /Cu -based catalysts are highly active for the hydrogenation of esters, however, how to efficiently tune the ratio of Cu /Cu and stabilize the Cu is a great challenge. In this work, it is demonstrated that doped Ti ions can tune the ratio of Cu /Cu and stabilize the Cu by the TiOCu bonds in Ti-doped SiO supported Cu nanoparticle (Cu/Ti-SiO ) catalysts for the high conversion of dimethyl adipate to 1,6-hexanediol. In the synthesis of the catalysts, the Ti OCu bonds promote the reduction of Cu to Cu by forming Ti O Cu (O : oxygen vacancy) bonds and the amount of Ti doping can tune the ratio of Cu /Cu . In the catalytic reaction, the O vacancy activates CO in the ester by forming new Ti O Cu bonds (O : reactant oxygen), and Cu activates hydrogen. After the products are desorbed, the Ti O Cu bonds return to the initial state of Ti O Cu bonds. The reversible TiOCu bonds greatly improve the activity and stability of the Cu/Ti-SiO catalysts. When the content of Ti is controlled at 0.4 wt%, the conversion and selectivity can reach 100% and 98.8%, respectively, and remain stable for 260 h without performance degradation.

摘要

二酯加氢制二醇是化学工业中的一个重要过程。廉价的铜/铜基催化剂对酯的加氢反应具有高活性,然而,如何有效地调节铜/铜的比例并稳定铜是一个巨大的挑战。在这项工作中,研究表明,在掺杂钛的二氧化硅负载铜纳米颗粒(Cu/Ti-SiO)催化剂中,掺杂的钛离子可以通过TiOCu键来调节铜/铜的比例并稳定铜,从而实现己二酸二甲酯向1,6-己二醇的高转化率。在催化剂的合成过程中,TiOCu键通过形成TiOCu(O:氧空位)键促进Cu还原为Cu,并且钛的掺杂量可以调节铜/铜的比例。在催化反应中,氧空位通过形成新的TiOCu键(O:反应物氧)活化酯中的CO,而Cu活化氢。产物脱附后,TiOCu键恢复到TiOCu键的初始状态。可逆的TiOCu键极大地提高了Cu/Ti-SiO催化剂的活性和稳定性。当Ti的含量控制在0.4 wt%时,转化率和选择性分别可达100%和98.8%,并在260 h内保持稳定,性能无下降。

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