Influence of ultrasonic combined supercritical-CO electrodeposition process on copper film fabrication: Electrochemical evaluation.

Introducing ultrasound irradiation to the electrodeposition process can significantly improve the physical and chemical properties of deposited films. Meanwhile, the beneficial effects from supercritical-CO such as high diffusivity, high permeability, low surface tension, etc., would improve the electrodeposition process with better surface quality. In the shed of the light, the present work deals with the preparation of copper (Cu) films using the integrated techniques, i.e., ultrasonic-assisted supercritical-CO (US-SC-CO) electrodeposition approach. For comparison, Cu films were also prepared by normal supercritical-CO (SC-CO) and conventional electrodeposition methods. To investigate the characteristics of Cu films, surface morphology analysis, roughness analysis, X-ray diffraction studies (XRD), Linear polarization, electrochemical impedance spectroscopy (EIS), and cyclic voltammetry (CV) were performed. In this work, EIS analysis was utilized for interfacial charge transfer resistance analysis with 5 mM [Fe(CN)] redox system and corrosion analysis with 3.5 wt% NaCl solution. The observed results revealed that the film prepared with the US-SC-CO method have superior properties than those produced by normal SC-CO and conventional methods. Due to the combination of US-SC-CO, the cavitation implosion occurs rapidly that enriches the deposited film quality, such as sufficient grain size, smoother surface, enhanced corrosion resistance, and charge carrier dynamics. On the other hand, the ultrasound effect with SC-CO helped to remove the weakly adhered metal ions on the electrode's surface.