Wang P, Majerus S J A, Karam R, Hanzlicek B, Lin D L, Zhu H, Anderson J M, Damaser M S, Zorman C A, Ko W H
Electrical Engineering, Case School of Engineering, Case Western Reserve University, Cleveland, OH, USA.
Advanced Platform Technology Center, Louis Stokes Cleveland VA Medical Center, Cleveland, OH, USA.
Int Solid State Sens Actuators Microsyst Conf. 2015 Jun;2015:484-487. doi: 10.1109/transducers.2015.7180966. Epub 2015 Aug 6.
This paper reports long-term evaluation of a micropackage technology for an implantable MEMS pressure sensor. The all-polymer micropackage survived 160 days when subjected to accelerated lifetime testing at 85 °C in a 1% wt. saline solution. The package shows minimum effect on sensors' sensitivity and nonlinearity, which deviated by less than 5% and 0.3%, respectively. A 6-month evaluation of 16 MEMS-based pressure sensors demonstrated that the proposed micropackage has good biocompatibility and can protect the MEMS pressure sensor. To the best of our knowledge, these results establish new lifetime records for devices packaged using an all-polymer micropackaging approach.
本文报道了一种用于植入式微机电系统（MEMS）压力传感器的微封装技术的长期评估。当在85°C的1%重量百分比盐溶液中进行加速寿命测试时，全聚合物微封装存活了160天。该封装对传感器的灵敏度和非线性影响最小，分别偏差小于5%和0.3%。对16个基于MEMS的压力传感器进行的为期6个月的评估表明，所提出的微封装具有良好的生物相容性，并且可以保护MEMS压力传感器。据我们所知，这些结果为采用全聚合物微封装方法封装的器件创造了新的寿命记录。
