Ahn Seung-Hee, Jeong Joonsoo, Kim Sung June
Department of Electrical and Computer Engineering, Seoul National University, Seoul 08826, Korea.
Department of Biomedical Engineering, School of Medicine, Pusan National University, Yangsan 50612, Korea.
Micromachines (Basel). 2019 Jul 31;10(8):508. doi: 10.3390/mi10080508.
The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of AlO, HfO, SiO, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.
开发可靠的用于可植入生物医学设备的长期封装技术对于植入物在体内几十年的安全稳定运行至关重要。然而，基于钛或陶瓷封装的传统技术由于其有限的可扩展性、与微制造工艺的不兼容性以及小型化困难，不适用于封装微制造设备。已提出多种用于微制造植入物封装的新兴材料，包括AlO、HfO、SiO、SiC和金刚石的薄膜无机涂层，以及聚酰亚胺、聚对二甲苯、液晶聚合物、硅橡胶、SU-8和环烯烃共聚物等有机聚合物。虽然这些材料均未被证明具有与传统金属封装一样的密封性，也未广泛应用于监管批准的长期植入设备中，但一些研究通过多种制造和测试方法，在其长期封装性能方面展示出了有前景的结果。本综述文章旨在全面、最新地概述这些新兴材料的长期封装性能，特别关注那些定量估计了封装技术在水环境中寿命的出版物。
