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钴添加对电连接器用弹性铜镍硅基合金组织与性能的影响

Effects of Co Addition on the Microstructure and Properties of Elastic Cu-Ni-Si-Based Alloys for Electrical Connectors.

作者信息

Wang Zheng, Li Jiang, Fan Zhuangzhuang, Zhang Yi, Hui Songxiao, Peng Lijun, Huang Guojie, Xie Haofeng, Mi Xujun

机构信息

State Key Laboratory of Nonferrous Metals and Processes, GRIMAT Group Co., Ltd., Beijing 100088, China.

China Academy of Space Technology, Beijing 100094, China.

出版信息

Materials (Basel). 2021 Apr 16;14(8):1996. doi: 10.3390/ma14081996.

Abstract

The properties and microstructure evolution of quaternary Cu-Ni-Co-Si alloys with different Ni/Co mass ratios were investigated. The microstructure and morphological characteristics of the precipitates were analyzed by using electron backscatter diffraction (EBSD), transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HRTEM). The mechanical properties and conductivity of the alloys were significantly improved after the addition of Co. The grains presented an obvious growth trend with an increase in Ni/Co mass ratios, and the appropriate Co accelerated the recrystallization process. The δ-(Ni, Co)Si phases of the Cu-Ni-Co-Si alloys and δ-NiSi phases of the Cu-Ni-Si alloys shared the same crystal structure and orientation relationships with the matrix, which had two variant forms: δ and δ phases. The precipitates preferential grew along with the direction of the lowest energy and eventually exhibited two different morphologies. Compared with that of the Cu-Ni-Si alloy, the volume fraction of precipitates in the alloys with Co was significantly improved, accompanied by an increase in the precipitated phase size. The addition of Co promoted the precipitation of the precipitated phase and further purified the matrix. A theoretical calculation was conducted for different strengthening mechanisms, and precipitation strengthening was the key reinforcement mechanism. Moreover, the kinetic equations of both alloys were obtained and coincided well with the experimental results.

摘要

研究了不同镍钴质量比的四元铜镍钴硅合金的性能和微观结构演变。采用电子背散射衍射(EBSD)、透射电子显微镜(TEM)和高分辨率透射电子显微镜(HRTEM)分析了析出相的微观结构和形态特征。添加钴后,合金的力学性能和导电性显著提高。随着镍钴质量比的增加,晶粒呈现出明显的长大趋势,适量的钴加速了再结晶过程。铜镍钴硅合金的δ-(镍,钴)硅相和铜镍硅合金的δ-镍硅相与基体具有相同的晶体结构和取向关系,有两种变体形式:δ相和δ相。析出相优先沿能量最低的方向生长,最终呈现出两种不同的形态。与铜镍硅合金相比,含钴合金中析出相的体积分数显著提高,同时析出相尺寸增大。钴的添加促进了析出相的析出,进一步净化了基体。对不同强化机制进行了理论计算,析出强化是关键的强化机制。此外,得到了两种合金的动力学方程,与实验结果吻合良好。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f538/8074117/915efb7125e8/materials-14-01996-g001.jpg

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