Effects of Co Addition on the Properties and Microstructure of Cu-Ni-Si-P-Mg Alloys.

Cu-Ni-Si alloys are widely used in electrical and electronic industry owing to excellent electrical conductivity and strength. A suitable addition of Co in the Cu-Ni-Si alloys can improve its strength and deteriorate its electrical conductivity. In this work, Cu-Ni-Co-Si-P-Mg alloys with different Co content are employed to investigate the effects of Co on the properties and microstructure. The results showed that Co addition lead to the formation of (Ni, Co)Si precipitates. (Ni, Co)Si precipitate is harder to coarsen than δ-Ni2Si during aging. The larger the Co content in the alloys is, the smaller the precipitates formed is. There exists a threshold content of Co to divide the studied alloys into two groups. One group of theses alloys with <1 wt.% Co or Co/Ni ratio <0.56 has the same aging behavior as the Cu-Ni-Si-P-Mg alloy. On the contrary, the time to reach the peak hardness of aging for another group can be obviously delayed and its electrical conductivity decreases slightly with the increase of Co content. It can be attributed to the lower diffusion rate of Co than that of Ni in the Cu matrix. Meanwhile, the Co addition can inhibit the formation of P-enriched Ni-P phase in Co-containing alloys during aging. The as-quenched Cu-1.6Ni-1.2Co-0.65Si-0.1P-0.05Mg alloy can reach 257 HV and 38.7%IACS after aging at 500 °C for 3 h, respectively.