Gao Zhifei, Wang Linbing, Yang Hailu
National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China.
Joint USTB Virginia Tech Lab on Multifunctional Materials, USTB, Virginia Tech, Department Civil & Environmental Engineering, Blacksburg, VA 24061, USA.
Materials (Basel). 2021 Apr 13;14(8):1944. doi: 10.3390/ma14081944.
The preload load on concrete during heating is considered to cause a 'densification' of cement mortar which led to the increased compressive strength. In order to assess the influence of coupled load and heating effects on porosity characteristics of concrete, the porosity of mortar after mechanical and thermal loading was measured by X-ray computed tomography (X-ray CT). The preload at pre-stress ratios of 0, 0.2, 0.4, and 0.6 (ratio of stress applied to the specimen to its compressive strength at room temperature) were applied on mortar specimens during heating. The residual compressive strengths of the heated and stressed mortar specimens were tested after cooling to room temperature. Combined analyses of the residual compressive strength test results and porosity test results, it shows that the porosity of the specimens under the coupled stressing and heating conditions were slightly lower than that under the unstressed conditions; however, the conclusion that the increase of compressive strength of stressed mortar was caused by the 'densification' of cement paste was insufficient. The preload reduced the cracks in the mortar, especially the crack induced due to the thermal mismatch in aggregates and hardened cement paste (HCP), and this may account for the increased compressive strength of stressed mortar.
加热过程中混凝土所承受的预载被认为会导致水泥砂浆“致密化”,从而使抗压强度提高。为了评估耦合荷载和加热效应对混凝土孔隙率特性的影响,通过X射线计算机断层扫描(X射线CT)测量了机械和热加载后砂浆的孔隙率。在加热过程中,对砂浆试件施加预应力比为0、0.2、0.4和0.6(施加于试件的应力与室温下其抗压强度之比)的预载。加热并承受应力的砂浆试件冷却至室温后,测试其残余抗压强度。对残余抗压强度试验结果和孔隙率试验结果进行综合分析表明,耦合应力和加热条件下试件的孔隙率略低于无应力条件下的孔隙率;然而,关于受压砂浆抗压强度的提高是由水泥浆“致密化”引起的这一结论并不充分。预载减少了砂浆中的裂缝,尤其是由骨料与硬化水泥浆(HCP)之间的热不匹配引起的裂缝,这可能是受压砂浆抗压强度提高的原因。