National High Magnetic Field Laboratory, 1800 East Paul Dirac Drive, Tallahassee, Florida 32310, United States.
Department of Applied Science, William & Mary, Williamsburg, Virginia 23185, United States.
J Phys Chem Lett. 2021 May 13;12(18):4392-4399. doi: 10.1021/acs.jpclett.1c00636. Epub 2021 May 3.
The amino-terminal-copper-and-nickel-binding (ATCUN) motif, a tripeptide sequence ending with a histidine, confers important functions to proteins and peptides. Few high-resolution studies have been performed on the ATCUN motifs of membrane-associated proteins and peptides, limiting our understanding of how they stabilize Cu/Ni in membranes. Here, we leverage solid-state NMR to investigate metal-binding to piscidin-1 (P1), a host-defense peptide featuring F1F2H3 as its ATCUN motif. Bound to redox ions, P1 chemically and physically damages pathogenic cell membranes. We design C/N correlation experiments to detect and assign the deprotonated nitrogens produced and/or shifted by Ni-binding. Occupying multiple chemical states in P1-apo, H3 and the neighboring H4 respond to metalation by populating only the τ-tautomer. H3, as a proximal histidine, directly coordinates the metal, compared to the distal H4. Density functional theory calculations reflect this noncanonical arrangement and point toward cation-π interactions between the F1/F2/H4 aromatic rings and metal. These structural findings, which are relevant to other ATCUN-containing membrane peptides, could help design new therapeutics and materials for use in the areas of drug-resistant bacteria, neurological disorders, and biomedical imaging.
氨基末端铜镍结合(ATCUN)基序,以组氨酸结尾的三肽序列,赋予蛋白质和肽重要的功能。很少有针对膜相关蛋白和肽的 ATCUN 基序的高分辨率研究,这限制了我们对它们如何在膜中稳定 Cu/Ni 的理解。在这里,我们利用固态 NMR 研究了鱼抗菌肽 1(P1)的金属结合情况,P1 是一种具有 F1F2H3 作为 ATCUN 基序的宿主防御肽。与氧化还原离子结合后,P1 会对病原细胞膜造成化学和物理损伤。我们设计了 C/N 相关实验来检测和分配由 Ni 结合产生和/或移位的去质子化氮。在 P1-apo 中占据多个化学状态的 H3 和相邻的 H4 通过仅填充 τ-互变异构体来响应金属化。作为邻近的组氨酸,H3 直接与金属配位,而不是远端的 H4。密度泛函理论计算反映了这种非典型排列,并指出 F1/F2/H4 芳环与金属之间存在阳离子-π 相互作用。这些结构发现与其他含有 ATCUN 的膜肽有关,可帮助设计用于治疗耐药菌、神经紊乱和生物医学成像等领域的新疗法和材料。