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聚脯氨酸II螺旋肽在金表面的自组装与重排

Self-Assembly and Rearrangement of a Polyproline II Helix Peptide on Gold.

作者信息

Hostert Jacob D, Loney Charles N, Pramounmat Nuttanit, Yan Katherine, Su Zihang, Renner Julie N

机构信息

Department of Chemical and Biomolecular Engineering, Case Western Reserve University, Cleveland, Ohio 44106, United States.

出版信息

Langmuir. 2021 May 25;37(20):6115-6122. doi: 10.1021/acs.langmuir.0c03583. Epub 2021 May 11.

Abstract

Polyproline peptide sequences have gained popularity as anchors for peptide-based self-assembled monolayers (SAMs) due to their attractive properties. In this work, peptides containing the polyproline II helix (PPII) conformation were designed and assembled on gold (Au). A quartz crystal microbalance with dissipation was used to characterize SAM formation kinetics and related properties. Peptides were designed with the sequence (GPPPPPG)C. It was discovered that a biexponential adsorption and rearrangement model describes the binding kinetics of the PPII-containing peptide on Au. In this model, an initial reversible binding step is followed by an irreversible rearrangement step, given by parameter . This study found to be approximately 0.00064 s for the PPII-containing peptides. Similarly, we found that the adsorption of the PPII-containing peptide on Au, given by Δ, was thermodynamically favorable (-7.8 kcal mol) and comparable to other common thiol terminated SAMs on Au. Furthermore, we characterized SAM properties via QCM-D, Fourier-transform infrared (FTIR) spectroscopy, and electrochemical techniques to reveal high molecular density SAMs consisting of PPII helices. In addition, these SAMs were found to have high antifouling properties. Overall, this study characterizes the fundamental assembly mechanisms, particularly, rearrangement of PPII-containing peptides for the first time, which will be useful in the designing of future peptide-based SAMs with high surface coverage and antifouling properties.

摘要

多聚脯氨酸肽序列因其具有吸引力的特性,作为基于肽的自组装单分子层(SAMs)的锚定物而受到欢迎。在这项工作中,设计了含有多聚脯氨酸II螺旋(PPII)构象的肽,并将其组装在金(Au)上。使用具有耗散功能的石英晶体微天平来表征SAM形成动力学及相关特性。设计的肽序列为(GPPPPPG)C。研究发现,双指数吸附和重排模型描述了含PPII肽在Au上的结合动力学。在该模型中,初始的可逆结合步骤之后是不可逆的重排步骤,由参数 给出。本研究发现含PPII肽的 约为0.00064 s。同样,我们发现含PPII肽在Au上的吸附量(由Δ给出)在热力学上是有利的(-7.8 kcal mol),并且与Au上其他常见的硫醇封端的SAMs相当。此外,我们通过石英晶体微天平 - 耗散监测技术(QCM-D)、傅里叶变换红外(FTIR)光谱和电化学技术对SAM特性进行了表征,以揭示由PPII螺旋组成的高分子密度SAMs。此外,发现这些SAMs具有高抗污性能。总体而言,本研究首次表征了基本的组装机制,特别是含PPII肽的重排,这将有助于设计未来具有高表面覆盖率和抗污性能的基于肽的SAMs。

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