Manna Rakesh, Kumar Srivastava Suneel, Mittal Vikas
Department of Chemistry, Indian Institute of Technology, Kharagpur 721302, India.
Department of Chemical Engineering, Khalifa University of Science and Technology (KUST), Sas Al Nakh! Campus, Abu Dhabi, P.O. 2533, United Arab Emirates.
J Nanosci Nanotechnol. 2021 Nov 1;21(11):5569-5582. doi: 10.1166/jnn.2021.19468.
The presence of microcapacitors near percolatrion threshold determines dielectric permittivity of a material. Motivated by this concept, we focused our work by preferentially allocating functionalized reduced graphene oxide (FRGO) in hard segment (disperse phase) of Thermoplastic polyurethane (TPU) by solution blending method and characterized. Morphological studies of TPU/FRGO nanocomposites established homogeneous dispersion of FRGO throughout the TPU matrix. It is noted that TPU/FRGO (1 phr) nanocomposites exhibit maximum increase in tensile strength (33%) and elongation at break (10%). Thermogravimetric analysis (TGA) showed maximum enhancement in onset of decomposition temperature (6 °C) in 2 phr FRGO loaded TPU. Differential scanning calorimetry (DSC) analysis showed maximum reduction (2 °C) in glass transition temperature (T) of soft segment of TPU followed by maximum improvements in melting temperature (4 °C) as well as crystallization temperature (22 °C) of hard segment compared to neat TPU. Further, a significantly high value of dielectric permittivity (401) is achieved in 1.5 phr loaded FRGO at 100 Hz due to the formation of significantly higher number of microcapacitors near the percolation threshold. It is anticipated that such thermally stable and mechanically strong high dielectric TPU/FRGO nanocomposites can find applications in the field of electronic devices.
接近渗流阈值的微电容器的存在决定了材料的介电常数。受这一概念的启发,我们通过溶液共混法将功能化还原氧化石墨烯(FRGO)优先分配到热塑性聚氨酯(TPU)的硬段(分散相)中,并对其进行了表征,以此开展我们的工作。TPU/FRGO纳米复合材料的形态学研究表明FRGO在整个TPU基体中均匀分散。值得注意的是,TPU/FRGO(1 phr)纳米复合材料的拉伸强度最大提高了33%,断裂伸长率最大提高了10%。热重分析(TGA)表明,在负载2 phr FRGO的TPU中,分解温度起始点的提高幅度最大(约6℃)。差示扫描量热法(DSC)分析表明,与纯TPU相比,TPU软段的玻璃化转变温度(T)最大降低了约2℃,随后硬段的熔点(约4℃)以及结晶温度(约22℃)有最大程度的提高。此外,由于在渗流阈值附近形成了数量显著更多的微电容器,在1.5 phr负载的FRGO中,在100 Hz时实现了显著高的介电常数(401)。预计这种热稳定且机械性能强的高介电TPU/FRGO纳米复合材料可在电子器件领域找到应用。