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通过倒装芯片键合实现铒掺杂硅酸钇(Er:YSiO)与薄膜铌酸锂的光子集成。

Photonic integration of Er:YSiO with thin-film lithium niobate by flip chip bonding.

作者信息

Yang Likai, Wang Sihao, Shen Mohan, Xu Yuntao, Xie Jiacheng, Tang Hong X

出版信息

Opt Express. 2021 May 10;29(10):15497-15504. doi: 10.1364/OE.423659.

Abstract

Rare earth ions are known as promising candidates for building quantum light-matter interface. However, tunable photonic cavity access to rare earth ions in their desired host crystal remains challenging. Here, we demonstrate the integration of erbium doped yttrium orthosilicate (Er:YSiO) with thin-film lithium niobate photonic circuit by plasma-activated direct flip chip bonding. Resonant coupling to erbium ions is realized by on-chip electro-optically tuned high Q lithium niobate micro-ring resonators. Fluorescence and absorption of erbium ions at 1536.48 nm are measured in the waveguides, while the collective ion-cavity cooperativity with micro-ring resonators is assessed to be 0.36. This work presents a versatile scheme for future rare earth ion integrated quantum devices.

摘要

稀土离子被认为是构建量子光与物质界面的有前途的候选者。然而,在所需的基质晶体中实现对稀土离子的可调谐光子腔仍具有挑战性。在此,我们通过等离子体激活直接倒装芯片键合,展示了掺铒正硅酸钇(Er:YSiO)与薄膜铌酸锂光子电路的集成。通过片上电光调谐的高Q值铌酸锂微环谐振器实现了与铒离子的共振耦合。在波导中测量了铒离子在1536.48 nm处的荧光和吸收,同时评估了与微环谐振器的集体离子-腔协同性为0.36。这项工作为未来的稀土离子集成量子器件提出了一种通用方案。

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