Alibakhshikenari Mohammad, Virdee Bal S, Salekzamankhani Shahram, Aïssa Sonia, See Chan H, Soin Navneet, Fishlock Sam J, Althuwayb Ayman A, Abd-Alhameed Raed, Huynen Isabelle, McLaughlin James A, Falcone Francisco, Limiti Ernesto
Electronic Engineering Department, University of Rome "Tor Vergata", Via del Politecnico 1, 00133, Rome, Italy.
Center for Communications Technology & Mathematics, School of Computing and Digital Media, London Metropolitan University, London, N7 8DB, UK.
Sci Rep. 2021 May 13;11(1):10218. doi: 10.1038/s41598-021-87712-y.
This paper presents the results of a study on developing an effective technique to increase the performance characteristics of antenna arrays for sub-THz integrated circuit applications. This is essential to compensate the limited power available from sub-THz sources. Although conventional array structures can provide a solution to enhance the radiation-gain performance however in the case of small-sized array structures the radiation properties can be adversely affected by mutual coupling that exists between the radiating elements. It is demonstrated here the effectiveness of using SIW technology to suppress surface wave propagations and near field mutual coupling effects. Prototype of 2 × 3 antenna arrays were designed and constructed on a polyimide dielectric substrate with thickness of 125 μm for operation across 0.19-0.20 THz. The dimensions of the array were 20 × 13.5 × 0.125 mm. Metallization of the antenna was coated with 500 nm layer of Graphene. With the proposed technique the isolation between the radiating elements was improved on average by 22.5 dB compared to a reference array antenna with no SIW isolation. The performance of the array was enhanced by transforming the patch to exhibit metamaterial characteristics. This was achieved by embedding the patch antennas in the array with sub-wavelength slots. Compared to the reference array the metamaterial inspired structure exhibits improvement in isolation, radiation gain and efficiency on average by 28 dB, 6.3 dBi, and 34%, respectively. These results show the viability of proposed approach in developing antenna arrays for application in sub-THz integrated circuits.
本文介绍了一项关于开发有效技术以提高用于太赫兹以下集成电路应用的天线阵列性能特征的研究结果。这对于补偿太赫兹以下源可用的有限功率至关重要。尽管传统阵列结构可以提供提高辐射增益性能的解决方案,然而在小型阵列结构的情况下,辐射特性可能会受到辐射元件之间存在的相互耦合的不利影响。本文展示了使用基片集成波导(SIW)技术抑制表面波传播和近场相互耦合效应的有效性。设计并在厚度为125μm的聚酰亚胺介电基板上构建了2×3天线阵列原型,用于在0.19 - 0.20太赫兹范围内工作。阵列尺寸为20×13.5×0.125mm。天线的金属化层涂有500nm厚的石墨烯。与没有SIW隔离的参考阵列天线相比,采用所提出的技术,辐射元件之间的隔离平均提高了22.5dB。通过使贴片呈现超材料特性来提高阵列的性能。这是通过将贴片天线嵌入带有亚波长缝隙的阵列中来实现的。与参考阵列相比,受超材料启发的结构在隔离、辐射增益和效率方面平均分别提高了28dB、6.3dBi和34%。这些结果表明了所提出的方法在开发用于太赫兹以下集成电路应用的天线阵列方面的可行性。