高可靠性、高熔点、无铅、混合焊锡膏系统-BiAgX。

High-reliability, high-melting, lead-free, mixed solder paste System-BiAgX.

机构信息

Indium Corporation, 34 Robinson Rd., Clinton, New York 13323, USA.

出版信息

Rev Sci Instrum. 2021 Sep 1;92(9):099501. doi: 10.1063/5.0064142.

Abstract

BiAgX, a mixed solder powder paste composed of a primary high-melting solder powder and an additive low-melting solder powder, exhibited a melting temperature above 260 °C and was comparable to, or even better than, the reliability of high-lead solders. The additive solder is designed to react preferentially with various surface metallizations and form a controllable intermetallic layer. Inside the joints, sub-micron AgSn particles are dispersed surrounding Bi colonies, which constrain the dislocation movement, thus enhancing strength, ductility, and associated joint reliability.

摘要

BiAgX 是一种混合焊锡粉膏，由主要的高熔点焊锡粉和添加剂低熔点焊锡粉组成，其熔点高于 260°C，可靠性可与高铅焊料相媲美，甚至更好。添加剂焊料旨在优先与各种表面金属化反应，并形成可控的金属间化合物层。在焊点内部，亚微米级的 AgSn 颗粒分散在 Bi 团簇周围，限制位错的运动，从而提高强度、延展性和相关的连接可靠性。