Shimizu Takao, Hasegawa Miyu, Ishihama Keisuke, Tateyama Akinori, Yamaoka Wakiko, Tsurumaru Risako, Yoshimura Shintaro, Sato Yusuke, Funakubo Hiroshi
Research Center for Functional Materials, National Institute for Materials Science, Tsukuba 305-0044, Japan.
School of Materials and Chemical Technology, Tokyo Institute of Technology, Yokohama 226-8502, Japan.
ACS Appl Mater Interfaces. 2021 Dec 8;13(48):57532-57539. doi: 10.1021/acsami.1c15713. Epub 2021 Nov 23.
Strong electromechanical coupling is observed in tetragonal Pb-free 0.7(BiNa)TiO-0.3BaTiO films, which is far from the morphotropic phase boundary, prepared by pulsed laser deposition on a Si substrate. The tensile strain induced during cooling causes in-plane polarization in an oriented film on a Si substrate, while an epitaxial film grown on a SrTiO substrate exhibits out-of-plane polarization. - curve analysis reveals that the obtained piezoelectric coefficient for the film on the Si substrate ( ≈ 275 pm/V) is approximately eight times higher than that for the epitaxial film on the SrTiO substrate ( ≈ 34 pm/V). In situ X-ray diffraction analysis confirms the occurrence of domain switching under an electric field from in-plane to out-of-plane polarization. An effective piezoelectric stress coefficient, , of ∼19 C/m is obtained from a Si cantilever sample, which is the highest among the reported values for Pb-free piezoelectric films and is comparable to those for Pb-based films. The significant piezoelectric response produced by domain switching in the Pb-free materials with the composition far from the morphotropic phase boundary will expand future applications due to their both outstanding properties and environmental sustainability.
在通过脉冲激光沉积在硅衬底上制备的远离准同型相界的四方无铅0.7(BiNa)TiO-0.3BaTiO薄膜中观察到了强机电耦合。冷却过程中产生的拉伸应变在硅衬底上的取向薄膜中引起面内极化,而在SrTiO衬底上生长的外延薄膜则表现出面外极化。-曲线分析表明,在硅衬底上获得的薄膜的压电系数(≈275 pm/V)大约是在SrTiO衬底上外延薄膜的压电系数(≈34 pm/V)的八倍。原位X射线衍射分析证实了在电场作用下从面内极化到面外极化的畴切换的发生。从硅悬臂梁样品中获得的有效压电应力系数约为19 C/m,这是无铅压电薄膜报道值中最高的,与铅基薄膜相当。在远离准同型相界的组成的无铅材料中,畴切换产生的显著压电响应因其优异的性能和环境可持续性,将拓展未来的应用。