Pietruska Maria Julia, Waszkiewicz Emilia, Skurska Anna, Sajewicz Eugeniusz, Dolińska Ewa, Pietruska Małgorzata
Independent Researcher, ul. Waszyngtona 1/34, 15-269 Białystok, Poland.
Department of Periodontal and Oral Mucosa Diseases, Medical University of Białystok, ul. Waszyngtona 13, 15-269 Białystok, Poland.
Materials (Basel). 2021 Nov 18;14(22):6967. doi: 10.3390/ma14226967.
The purpose of the study was to evaluate cone beam computed tomography (CBCT) after piezocision-assisted orthodontic maxillary arch expansion.
Forty CBCT images of 20 patients taken before and after treatment were included in the study. The following radiographic parameters were measured: buccal/palatal bone plate thickness measured in three locations, 0.5 mm, 3.5 mm, and 5 mm from the margin of alveolar process; cemento-enamel junction-crest distance (CEJ-C) measured at buccal (CEJ-B) and palatal/lingual (CEJ-P) aspects.
After treatment there were insignificant changes in CEJ-C and thickness of buccal/palatal plates for all the dental groups except for incisors and premolars. CEJ-B increased by 1.43 mm on premolars and CEJ-P by 1.65 mm on incisors and by 0.31 mm on premolars. On the incisors, the buccal plate width increased significantly, by 0.2 mm and 0.44 mm at 3.5-mm and 5-mm measurement points. On premolars, the buccal plate width decreased in three measuring points by 0.27 mm, 0.37 mm, and 0.25 mm.
Piezocision-assisted orthodontic maxillary arch expansion does not cause evident negative changes of cortical plates except for the premolar region. Therefore, premolars may be at greater risk of buccal plate loss than other teeth.
本研究的目的是评估压电切开辅助正畸上颌扩弓后的锥形束计算机断层扫描(CBCT)。
本研究纳入了20例患者治疗前后的40张CBCT图像。测量以下影像学参数:在距牙槽嵴边缘0.5mm、3.5mm和5mm的三个位置测量颊侧/腭侧骨板厚度;在颊侧(CEJ-B)和腭侧/舌侧(CEJ-P)测量牙骨质-釉质界至牙槽嵴顶的距离(CEJ-C)。
治疗后,除切牙和前磨牙外所有牙组的CEJ-C和颊侧/腭侧骨板厚度变化不显著。前磨牙的CEJ-B增加了1.43mm,切牙的CEJ-P增加了1.65mm,前磨牙的CEJ-P增加了0.31mm。在切牙上,颊侧骨板宽度在3.5mm和5mm测量点处显著增加,分别增加了0.2mm和0.44mm。在前磨牙上,颊侧骨板宽度在三个测量点处分别减少了0.27mm、0.37mm和0.25mm。
压电切开辅助正畸上颌扩弓除前磨牙区域外不会引起皮质骨板明显的负面变化。因此,前磨牙颊侧骨板丧失的风险可能比其他牙齿更高。