Liu Lixin, Gong Penglai, Liu Kailang, Nie Anmin, Liu Zhongyuan, Yang Sanjun, Xu Yongshan, Liu Teng, Zhao Yinghe, Huang Li, Li Huiqiao, Zhai Tianyou
State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China.
Department of Physics, Southern University of Science and Technology, Shenzhen, 5158055, P. R. China.
Adv Mater. 2022 Feb;34(7):e2106041. doi: 10.1002/adma.202106041. Epub 2022 Jan 8.
Encapsulation is critical for devices to guarantee their stability and reliability. It becomes an even more essential requirement for devices based on 2D materials with atomic thinness and far inferior stability compared to their bulk counterparts. Here a general van der Waals (vdW) encapsulation method for 2D materials using Sb O layer of inorganic molecular crystal fabricated via thermal evaporation deposition is reported. It is demonstrated that such a scalable encapsulation method not only maintains the intrinsic properties of typical air-susceptible 2D materials due to their vdW interactions but also remarkably improves their environmental stability. Specifically, the encapsulated black phosphorus (BP) exhibits greatly enhanced structural stability of over 80 days and more sustaining-electrical properties of 19 days, while the bare BP undergoes degradation within hours. Moreover, the encapsulation layer can be facilely removed by sublimation in vacuum without damaging the underlying materials. This scalable encapsulation method shows a promising pathway to effectively enhance the environmental stability of 2D materials, which may further boost their practical application in novel (opto)electronic devices.
封装对于确保器件的稳定性和可靠性至关重要。对于基于二维材料的器件而言，这一要求变得更为关键，因为这些二维材料具有原子级的薄度，且与它们的块状对应物相比稳定性要差得多。本文报道了一种通用的范德华（vdW）封装方法，该方法使用通过热蒸发沉积制备的无机分子晶体的Sb O层对二维材料进行封装。结果表明，这种可扩展的封装方法不仅由于范德华相互作用而保持了典型的易受空气影响的二维材料的固有特性，而且还显著提高了它们的环境稳定性。具体而言，封装后的黑磷（BP）表现出大大增强的结构稳定性，超过80天，以及更持久的电学性能，达19天，而裸露的BP在数小时内就会降解。此外，封装层可以通过在真空中升华轻松去除，而不会损坏底层材料。这种可扩展的封装方法为有效提高二维材料的环境稳定性展示了一条有前景的途径，这可能会进一步推动它们在新型（光）电子器件中的实际应用。
