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铜合金表面核酸降解能力的定量评估及其与抗菌活性的相关性

Quantitative Evaluation of Nucleic Acid Degradability of Copper Alloy Surfaces and Its Correlation to Antibacterial Activity.

作者信息

Yamamoto Akiko, Tanaka Shinji, Ohishi Keiichiro

机构信息

Research Center for Functional Materials, National Institute for Materials Science, 1-1 Namiki, Tsukuba 305-0044, Japan.

Research & Development Department, Sambo Plant, Mitsubishi Materials Corporation, Sambo-cho 8-374, Sakai-ku, Sakai-shi 590-0906, Japan.

出版信息

Antibiotics (Basel). 2021 Nov 24;10(12):1439. doi: 10.3390/antibiotics10121439.

Abstract

Copper (Cu) and its alloys have bactericidal activity known as "contact killing" with degradation of nucleic acids inside the bacteria, which is beneficial to inhibit horizontal gene transfer (HGF). In order to understand the nucleic acid degradability of Cu and its alloy surfaces, we developed a new in vitro method to quantitatively evaluate it by a swab method under a "dry" condition and compared it with that of commercially available antibacterial materials such as antibacterial stainless steel, pure silver, and antibacterial resins. As a result, only Cu and its alloys showed continuous degradation of nucleic acids for up to 6 h of contact time. The nucleic acid degradability levels of the Cu alloys and other antibacterial materials correlate to their antibacterial activities evaluated by a film method referring to JIS Z 2801:2012 for Gram-negative () and Gram-positive () bacteria. Nucleic acid degradation by copper (I) and (II) chlorides was confirmed at the ranges over 10 mM and 1-20 mM, respectively, suggesting that the copper ion release may be responsible for the degradation of the nucleic acids on Cu and its alloy surfaces. In conclusion, the higher Cu content in the alloys gave higher nucleic acid degradability and higher antibacterial activities.

摘要

铜(Cu)及其合金具有杀菌活性,即“接触杀灭”,可使细菌内的核酸降解,这有利于抑制水平基因转移(HGT)。为了解铜及其合金表面的核酸降解能力,我们开发了一种新的体外方法,通过“干燥”条件下的拭子法对其进行定量评估,并将其与抗菌不锈钢、纯银和抗菌树脂等市售抗菌材料进行比较。结果显示,只有铜及其合金在长达6小时的接触时间内表现出核酸的持续降解。铜合金和其他抗菌材料的核酸降解能力水平与其通过参照JIS Z 2801:2012薄膜法对革兰氏阴性()和革兰氏阳性()细菌评估的抗菌活性相关。氯化亚铜(I)和氯化铜(II)分别在浓度超过10 mM和1 - 20 mM的范围内可确认核酸降解,这表明铜离子释放可能是铜及其合金表面核酸降解的原因。总之,合金中较高的铜含量具有更高的核酸降解能力和更高的抗菌活性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3f8d/8698190/ee58e173ab87/antibiotics-10-01439-g001.jpg

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