Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures.

In order to present the multiple reflow process during electronic packaging, the influence of the different short-time reheating temperatures on the microstructure and shear strength of the Cu/Au80Sn20/Cu solder joints was studied and discussed. The results showed that high-quality Cu/Au80Sn20/Cu solder joints were obtained with 30 °C for 3 min. The joints were mainly composed of the ζ-(Au,Cu)Sn intermetallic compound (IMC) with an average thickness of 8 μm between Cu and solder matrix, and (ζ-(Au,Cu)Sn +δ-(Au,Cu)Sn) eutectic structure in the solder matrix. With an increase in the multiple reflow temperature from 180 °C to 250 °C, the microstructure of the joint interface showed little change due to the barrier effect of the formed ζ IMC layer and the limitation of short-time reheating on the element diffusion. The eutectic structures in the solder matrix were coarsened and transformed from lamellar to the bulk morphology. The shear strength of the as-welded joint reached 31.5 MPa. The joint shear strength decreased slightly with reheating temperatures lower than 200 °C, while it decreased significantly (by about 10%) with reheating temperatures above 250 °C compared to the as-welded joint. The shear strength of the joints was determined by the brittle solder matrix, showing that the joint strength decreased with the coarsening of the δ phase in the eutectic structure.