Li Junjie, Yu Xing, Shi Tielin, Cheng Chaoliang, Fan Jinhu, Cheng Siyi, Liao Guanglan, Tang Zirong
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, People's Republic of China.
Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, People's Republic of China.
Nanoscale Res Lett. 2017 Dec;12(1):255. doi: 10.1186/s11671-017-2037-5. Epub 2017 Apr 5.
A reliable Cu-Cu bonding joint was achieved by using the highly sinterable Cu nanoparticle paste. Pure copper nanoparticles used in the preparation of nanoparticle paste were synthesized through simple routes, with an average size of 60.5 nm. Under an Ar-H gas mixture atmosphere, the Cu nanoparticle paste exhibited large areas of fusion after sintering at 300 °C and reached a low electrical resistivity of 11.2 μΩ cm. With the same temperature as sintering, a compact Cu-Cu bonding joint was achieved under the pressure of 1.08 MPa and the shear strength of the joint could achieve 31.88 MPa. The shear strength and the elemental composition of the bonded joint were almost unchanged after aging test, which proves that the Cu-Cu bonding with this process has excellent thermal stability.
通过使用高烧结性的铜纳米颗粒浆料实现了可靠的铜-铜键合接头。制备纳米颗粒浆料所用的纯铜纳米颗粒通过简单的方法合成，平均尺寸为60.5纳米。在氩-氢混合气体气氛下，铜纳米颗粒浆料在300℃烧结后呈现出大面积的融合，并且达到了11.2μΩ·cm的低电阻率。在与烧结相同的温度下，在1.08MPa的压力下实现了致密的铜-铜键合接头，接头的剪切强度可达31.88MPa。老化试验后，键合接头的剪切强度和元素组成几乎没有变化，这证明采用该工艺的铜-铜键合具有优异的热稳定性。
