Kunčická Lenka, Kocich Radim, Kačor Petr, Jambor Michal, Marek Martin
Institute of Physics of Materials, Czech Academy of Sciences, Žižkova 22, 616 00 Brno, Czech Republic.
Faculty of Materials Science and Technology, VŠB-Technical University of Ostrava, 708 00 Ostrava-Poruba, Czech Republic.
Materials (Basel). 2022 Jan 27;15(3):1003. doi: 10.3390/ma15031003.
This study aims to characterize the correlations between electric characteristics and selected structural features of newly designed Al/Cu laminated conductors manufactured via room temperature rotary swaging. After swaging, the laminates with diameters of 15 mm were subjected to two different post-process annealing treatments. Structure analyses performed to evaluate the effects of thermomechanical processing were performed via scanning and transmission electron microscopies. Electric conductivity and resistivity of the laminates were experimentally measured and numerically simulated using models designed according to the real conditions. The results showed that the electric resistivity was affected by the grain size, bimodal grains' distribution (where observed), the presence of twins, and, last but not least, dislocation density. Among the influencing factors were the area fractions of Al and Cu at the cross-sections of the of the laminated conductors, too. The results revealed that fabrication of the laminate via the technology of rotary swaging introduced more advantageous combinations of electric and mechanical properties than fabrication by conventional manufacturing techniques. The lowest specific electric resistivity of 20.6 Ωm × 10 was measured for the laminated conductor subjected to the post-process annealing treatment at 350 °C, which imparted significant structure restoration (confirmed by the presence of fine, equiaxed, randomly oriented grains).
本研究旨在表征通过室温旋转锻造制造的新型铝/铜层压导体的电学特性与选定结构特征之间的相关性。锻造后，对直径为15毫米的层压板进行两种不同的后处理退火处理。通过扫描电子显微镜和透射电子显微镜进行结构分析，以评估热机械加工的效果。使用根据实际情况设计的模型对层压板的电导率和电阻率进行了实验测量和数值模拟。结果表明，电阻率受晶粒尺寸、双峰晶粒分布（如观察到的）、孪晶的存在以及最后但同样重要的位错密度影响。影响因素还包括层压导体横截面上铝和铜的面积分数。结果表明，与传统制造技术相比，通过旋转锻造技术制造层压板引入了更有利的电学和力学性能组合。对在350°C下进行后处理退火处理的层压导体测量到最低比电阻率为20.6Ωm×10，这带来了显著的结构恢复（通过细小、等轴、随机取向的晶粒的存在得到证实）。
