Kunčická Lenka, Kocich Radim
Faculty of Materials Science and Technology, VŠB-Technical University of Ostrava, 17. Listopadu 2172/15, 70800 Ostrava, Czech Republic.
Institute of Physics of Materials, Czech Academy of Sciences, Žižkova 22, 61600 Brno, Czech Republic.
Materials (Basel). 2023 Oct 4;16(19):6555. doi: 10.3390/ma16196555.
The study presents a method to prepare Al/Cu laminated conductors featuring two different stacking sequences using rotary swaging, a method of intensive plastic deformation. The primary focus of the work was to perform detailed characterization of the effects of room temperature swaging on the development of microstructures, including the Al/Cu interfaces, and internal misorientations pointed to the presence of residual stress within the laminates. The results revealed that both the Al and Cu components of the final laminates with 5 mm in diameter featured fine, more or less equiaxed, grains with no dominating preferential texture orientations (the maximum observed texture intensity was 2.3 × random for the Cu components of both the laminates). This fact points to the development of dynamic restoration processes during swaging. The analyses of misorientations within the grains showed that residual stress was locally present primarily in the Cu components. The Al components did not feature a substantial presence of misorientations, which confirms the dynamic recrystallization. Tensile testing revealed that the laminates with both the designed stacking sequences exhibited comparable UTS (ultimate tensile strength) of almost 280 MPa. However, notable differences were observed with regard to the plasticity (~3.5% compared to less than 1%). The laminate consisting of Al sheath and Cu wires exhibited very low plasticity as a result of significant work hardening of Al; this hypothesis was also confirmed with microhardness measurements. Observations of the interfaces confirmed satisfactory bonding of both the metallic components.
该研究提出了一种使用旋转锻造（一种强烈塑性变形方法）制备具有两种不同堆叠顺序的铝/铜层压导体的方法。这项工作的主要重点是详细表征室温锻造对微观结构发展的影响，包括铝/铜界面，以及内部取向差表明层压板内部存在残余应力。结果表明，最终直径为5毫米的层压导体中的铝和铜成分均具有细小的、或多或少等轴的晶粒，没有明显的优先织构取向（两种层压导体的铜成分观察到的最大织构强度为随机值的2.3倍）。这一事实表明在锻造过程中发生了动态回复过程。对晶粒内取向差的分析表明，残余应力主要局部存在于铜成分中。铝成分中没有明显的取向差，这证实了动态再结晶。拉伸试验表明，两种设计堆叠顺序的层压导体都表现出相当的抗拉强度，接近280兆帕。然而，在塑性方面观察到显著差异（分别为约3.5%和小于1%）。由铝护套和铜丝组成的层压导体由于铝的显著加工硬化而表现出非常低的塑性；这一假设也通过显微硬度测量得到了证实。对界面的观察证实了两种金属成分之间的良好结合。
