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TiC TMXene薄膜的声子热传输特性

Characterization of phonon thermal transport of TiCTMXene thin film.

作者信息

Wu Hao, Gu Jiaxin, Li Zhongcheng, Liu Wenxiang, Bao Hua, Lin Huan, Yue Yanan

机构信息

Key Laboratory of Hydraulic Machinery Transients (MOE), School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei, 430072, People's Republic of China.

University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.

出版信息

J Phys Condens Matter. 2022 Feb 10;34(15). doi: 10.1088/1361-648X/ac4f1c.

Abstract

Two-dimensional MXene materials with high electrotonic conductivity, good chemical stability, and unique laminar structure show great potential in the field of electrochemistry. In contrast to the widely concerned electrical properties, studies on the thermal properties of MXene materials are very limited. This paper presents a comprehensive analysis of the thermal properties of TiCTMXene thin film. Thermal diffusivity and thermal conductivity of TiCTfilms are characterized by the transient electro-thermal technique. The experimental results show a 16% enhancement in thermal conductivity when the temperature is increased from 307 K to 352 K. The phonon transport contributes substantially to thermal conductivity compared with electron transport. Molecular dynamic simulation is employed to further investigate the role of phonon thermal transport of TiClayer. It is found that the combined effect of specific heat capacity, stacking structure and internal stress states is responsible for the thermal transport performance of TiCTMXene thin film.

摘要

具有高电子电导率、良好化学稳定性和独特层状结构的二维MXene材料在电化学领域展现出巨大潜力。与广受关注的电学性质相比,关于MXene材料热学性质的研究非常有限。本文对TiCT MXene薄膜的热学性质进行了全面分析。采用瞬态电热技术表征了TiCT薄膜的热扩散率和热导率。实验结果表明,当温度从307 K升高到352 K时,热导率提高了16%。与电子输运相比,声子输运对热导率的贡献更大。采用分子动力学模拟进一步研究Ti层声子热输运的作用。发现比热容、堆积结构和内应力状态的综合作用决定了TiCT MXene薄膜的热输运性能。

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