Luisa F Alegria-Acevedo, DDS, MS, PhD, Department of Restorative Dentistry, School of Dentistry, State University of Ponta Grossa, Paraná, Brazil.
Mario Felipe Gutiérrez, DDS, MS, PhD, professor, Universidad de los Andes, Facultad de Odontología, Santiago, Chile, and University of Chile, Faculty of Dentistry, Institute for Research in Dental Sciences, Santiago, Chile.
Oper Dent. 2022 Jan 1;47(1):107-120. doi: 10.2341/20-203-L.
To evaluate the microshear bond strength (mSBS) of 10 universal adhesive systems applied on five different CAD/CAM restorative materials, immediately and after thermal aging.
Five CAD/CAM materials were selected: 1) feldspathic glass ceramic (FeCe); 2) pre-polymerized reinforced resin composite (ReRC); 3) leucite-reinforced glass ceramic (LeGC); 4) lithium disilicate (LiDi); and 5) yttrium-stabilized zirconium dioxide (ZiDi). For each material, 15 blocks were cut into four rectangular sections (6 × 6 × 6 mm; n=60 per group) and processed as recommended by the respective manufacturer. For each indirect material, the following adhesive systems were applied according to the respective manufacturer's instructions: 1) AdheSE Universal [ADU]; 2) All-Bond Universal [ABU]; 3) Ambar Universal [AMB]; 4) Clearfil Universal Bond [CFU]; 5) Futurabond U [FBU]; 6) One Coat 7 Universal [OCU]; 7) Peak Universal Bond [PUB]; 8) Prime&Bond Elect [PBE]; 9) Scotchbond Universal Adhesive [SBU]; 10) Xeno Select [XEN, negative control]. After the application of the adhesive system, cylinder-shaped transparent matrices were filled with a dual-curing resin cement (NX3) and light cured. Specimens were tested in shear mode at 1.0 mm/min (mSBS), after 24 hours and 10,000 thermal cycles (TC). All data were submitted to statistical analysis (α=0.05).
For FeCe, there was no significant decrease in mean mSBS for AMB, FBU, and SBU after TC when compared at 24 hours. For ReRC, AMB and SBU showed higher mean mSBS when compared to CFU and XEN, after 24 hours and TC. For LiDi, FBU and OCU showed higher mean mSBS when compared to CFU and XEN, after 24 hours and TC. For LeGC, AMB and PUB showed higher mean mSBS when compared to XEN, after 24 hours and TC. For ZiDi, OCU and SBU showed higher mean mSBS when compared to XEN, after 24 hours and TC. In addition, PBE and XEN showed the lowest mean mSBS after TC with higher percentage of bond strength reduction.
The mean mSBS among the different universal adhesives varied widely for each CAD/CAM material used. In addition, most universal adhesives underwent a statistically significant bond strength reduction after TC.
评估 10 种通用粘结剂系统在 5 种不同 CAD/CAM 修复材料上的微剪切粘结强度(mSBS),即刻和热老化后。
选择了 5 种 CAD/CAM 材料:1)长石玻璃陶瓷(FeCe);2)预聚合增强树脂复合材料(ReRC);3)锂辉石增强玻璃陶瓷(LeGC);4)硅酸二锂(LiDi);和 5)掺钇氧化锆二氧化物(ZiDi)。对于每种材料,将 15 个块切割成四个矩形部分(每组 6×6×6mm;n=60),并按照各自制造商的建议进行加工。对于每种间接材料,根据各自制造商的说明应用以下粘结剂系统:1)AdheSE Universal [ADU];2)All-Bond Universal [ABU];3)Ambar Universal [AMB];4)Clearfil Universal Bond [CFU];5)Futurabond U [FBU];6)One Coat 7 Universal [OCU];7)Peak Universal Bond [PUB];8)Prime&Bond Elect [PBE];9)Scotchbond Universal Adhesive [SBU];10)Xeno Select [XEN,阴性对照]。在应用粘结剂系统后,用双固化树脂水泥(NX3)填充圆柱形透明基质,并进行光固化。以 1.0mm/min 的速度(mSBS)在剪切模式下测试样本,在 24 小时和 10000 次热循环(TC)后进行测试。所有数据均进行统计学分析(α=0.05)。
对于 FeCe,与 24 小时相比,TC 后 AMB、FBU 和 SBU 的平均 mSBS 没有显著降低。对于 ReRC,与 CFU 和 XEN 相比,AMB 和 SBU 在 24 小时和 TC 后显示出更高的平均 mSBS。对于 LiDi,与 CFU 和 XEN 相比,FBU 和 OCU 在 24 小时和 TC 后显示出更高的平均 mSBS。对于 LeGC,与 XEN 相比,AMB 和 PUB 在 24 小时和 TC 后显示出更高的平均 mSBS。对于 ZiDi,与 XEN 相比,OCU 和 SBU 在 24 小时和 TC 后显示出更高的平均 mSBS。此外,PBE 和 XEN 在 TC 后显示出最低的平均 mSBS,其粘结强度降低的百分比更高。
对于使用的每种 CAD/CAM 材料,不同通用粘结剂之间的平均 mSBS 差异很大。此外,大多数通用粘结剂在 TC 后经历了统计学上显著的粘结强度降低。