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石墨烯/六方氮化硼平面异质结构中的近界面缺陷:对界面热输运的洞察

Near-Interface Defects in Graphene/H-BN In-Plane Heterostructures: Insights into the Interfacial Thermal Transport.

作者信息

Zhang Nana, Zhou Baoming, Li Dongbo, Qi Dongfeng, Wu Yongling, Zheng Hongyu, Yang Bing

机构信息

Centre for Advanced Laser Manufacturing (CALM), School of Mechanical Engineering, Shandong University of Technology, Zibo 255000, China.

Laboratory of Advanced Design, Manufacturing & Reliability for MEMS/NEMS/OEDS, School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China.

出版信息

Nanomaterials (Basel). 2022 Mar 22;12(7):1044. doi: 10.3390/nano12071044.

Abstract

Based on nonequilibrium molecular dynamics (NEMD) and nonequilibrium Green's function simulations, the interfacial thermal conductance (ITC) of graphene/h-BN in-plane heterostructures with near-interface defects (monovacancy defects, 585 and f5f7 double-vacancy defects) is studied. Compared to pristine graphene/h-BN, all near-interface defects reduce the ITC of graphene/h-BN. However, differences in defective structures and the wrinkles induced by the defects cause significant discrepancies in heat transfer for defective graphene/h-BN. The stronger phonon scattering and phonon localization caused by the wider cross-section in defects and the larger wrinkles result in the double-vacancy defects having stronger energy hindrance effects than the monovacancy defects. In addition, the approximate cross-sections and wrinkles induced by the 585 and f5f7 double-vacancy defects provide approximate heat hindrance capability. The phonon transmission and vibrational density of states (VDOS) further confirm the above results. The double-vacancy defects in the near-interface region have lower low-frequency phonon transmission and VDOS values than the monovacancy defects, while the 585 and f5f7 double-vacancy defects have similar low-frequency phonon transmission and VDOS values at the near-interface region. This study provides physical insight into the thermal transport mechanisms in graphene/h-BN in-plane heterostructures with near-interface defects and provides design guidelines for related devices.

摘要

基于非平衡分子动力学(NEMD)和非平衡格林函数模拟,研究了具有近界面缺陷(单空位缺陷、585和f5f7双空位缺陷)的石墨烯/h-BN面内异质结构的界面热导率(ITC)。与原始石墨烯/h-BN相比,所有近界面缺陷均降低了石墨烯/h-BN的ITC。然而,缺陷结构的差异以及缺陷引起的褶皱导致缺陷石墨烯/h-BN在热传递方面存在显著差异。缺陷中较宽的横截面和较大的褶皱所导致的更强的声子散射和声子局域化,使得双空位缺陷比单空位缺陷具有更强的能量阻碍效应。此外,585和f5f7双空位缺陷引起的近似横截面和褶皱提供了近似的热阻碍能力。声子传输和态密度振动(VDOS)进一步证实了上述结果。近界面区域的双空位缺陷比单空位缺陷具有更低的低频声子传输和VDOS值,而585和f5f7双空位缺陷在近界面区域具有相似的低频声子传输和VDOS值。本研究为具有近界面缺陷的石墨烯/h-BN面内异质结构的热输运机制提供了物理见解,并为相关器件提供了设计指导。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6c93/9000291/4b1387a53a59/nanomaterials-12-01044-g001.jpg

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