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由集成了相变材料的可切换定向耦合器实现的可重构光纤到波导耦合模块。

Reconfigurable fiber-to-waveguide coupling module enabled by phase-change material incorporated switchable directional couplers.

作者信息

Bhandari Bishal, Lee Sang-Shin

机构信息

Department of Electronic Engineering, Kwangwoon University, Seoul, 01897, South Korea.

出版信息

Sci Rep. 2022 May 4;12(1):7252. doi: 10.1038/s41598-022-11386-3.

Abstract

In silicon photonics, grating-assisted fiber-to-waveguide couplers provide out-of-plane coupling to facilitate wafer-level testing; however, their limited bandwidth and efficiency restrict their use in broadband applications. Alternatively, end-fire couplers overcome these constraints but require a dicing process prior usage, which makes them unsuitable for wafer-level testing. To address this trade-off, a reconfigurable fiber-to-waveguide coupling module is proposed and designed to allow for both grating-assisted and end-fire coupling in the same photonic circuit. The proposed module deploys a switchable directional coupler incorporating a thin layer of phase-change material, whose state is initially amorphous to render the coupler activated and hence facilitate grating-assisted coupling for wafer-level testing. The state can be altered into crystalline through a low-temperature annealing process to deactivate the directional coupler, thus facilitating broadband chip-level coupling through end-fire couplers. All the components encompassing conjoined switchable directional couplers as well as the grating and end-fire couplers were individually designed through rigorous simulations. They were subsequently assembled to establish the proposed reconfigurable coupling module, which was simulated and analyzed to validate the selective coupling operation. The proposed module gives rise to a low excess loss below 1.2 dB and a high extinction ratio over 13 dB throughout the C-band, when operating either under grating-assisted or end-fire input. The proposed reconfigurable coupling module is anticipated to be a practical solution for flexibly expediting the inspection of integrated photonic circuits on a wafer scale.

摘要

在硅光子学中,光栅辅助的光纤到波导耦合器提供面外耦合以方便晶圆级测试;然而,它们有限的带宽和效率限制了它们在宽带应用中的使用。相比之下,端射耦合器克服了这些限制,但在使用前需要进行切割工艺,这使得它们不适合晶圆级测试。为了解决这种权衡,提出并设计了一种可重构的光纤到波导耦合模块,以允许在同一光子电路中同时进行光栅辅助耦合和端射耦合。所提出的模块部署了一个包含相变材料薄层的可切换定向耦合器,其初始状态为非晶态,以使耦合器激活,从而便于进行晶圆级测试的光栅辅助耦合。通过低温退火工艺可以将状态改变为晶态,从而使定向耦合器失活,进而便于通过端射耦合器进行宽带芯片级耦合。所有包含相连的可切换定向耦合器以及光栅和端射耦合器的组件都通过严格的模拟进行了单独设计。随后将它们组装起来以建立所提出的可重构耦合模块,并对其进行模拟和分析以验证选择性耦合操作。当在光栅辅助或端射输入下工作时,所提出的模块在整个C波段产生低于1.2 dB的低额外损耗和超过13 dB的高消光比。所提出的可重构耦合模块有望成为一种实用的解决方案,用于灵活地加快晶圆级集成光子电路的检测。

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