通过将SMF-28超低损耗熔接到高数值孔径光纤，实现硅光子芯片极低的连接器到连接器损耗。

Low connector-to-connector loss through silicon photonic chips using ultra-low loss splicing of SMF-28 to high numerical aperture fibers.

作者信息

Yin Peichuan, Serafini John R, Su Zhan, Shiue Ren-Jye, Timurdogan Erman, Fanto Michael L, Preble Stefan

出版信息

Opt Express. 2019 Aug 19;27(17):24188-24193. doi: 10.1364/OE.27.024188.

DOI:10.1364/OE.27.024188

Abstract

Here we present extremely low connector-to-connector loss (≤3 dB) through silicon photonic chips using ultra-low loss (≤0.15 dB) splicing between SMF-28 and ultra-high numerical aperture (UHNA) fibers. The small MFD from the UHNA fibers enables strong coupling to hybrid TE/TM edge couplers achieving TM (TE) losses of 1.25 (2.35) dB per coupler and low polarization-dependent loss. Mode coupling simulations and tolerance are investigated to understand performance.

摘要

在此，我们展示了通过硅光子芯片实现的极低的连接器到连接器损耗（≤3 dB），这是利用单模光纤（SMF - 28）与超高数值孔径（UHNA）光纤之间的超低损耗（≤0.15 dB）拼接实现的。UHNA光纤的小模场直径能够与混合TE/TM边缘耦合器实现强耦合，每个耦合器的TM（TE）损耗为1.25（2.35）dB，并且偏振相关损耗较低。我们研究了模式耦合模拟和容差以了解其性能。