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铜源决定了植入涂层的化学性质和形貌,以最佳地偶联细胞反应和抗菌活性。

Copper source determines chemistry and topography of implant coatings to optimally couple cellular responses and antibacterial activity.

机构信息

Department of Prosthodontics and Periodontology, Piracicaba Dental School, University of Campinas (UNICAMP), Piracicaba, São Paulo 13414-903, Brazil; Regenerative Biomaterials, Dentistry, Radboudumc, 6500 HB Nijmegen, the Netherlands.

Department of Prosthodontics and Periodontology, Piracicaba Dental School, University of Campinas (UNICAMP), Piracicaba, São Paulo 13414-903, Brazil.

出版信息

Biomater Adv. 2022 Mar;134:112550. doi: 10.1016/j.msec.2021.112550. Epub 2021 Nov 15.

DOI:10.1016/j.msec.2021.112550
PMID:35523647
Abstract

Implant-related infections at the early healing period are considered one of the main risk factors in implant failure. Designing coatings that control bacterial adhesion and have cell stimulatory behavior remains a challenging strategy for dental implants. Here, we used plasma electrolytic oxidation (PEO) to produce antimicrobial coatings on commercially pure titanium (cpTi) using bioactive elements (calcium and phosphorus) and different copper (Cu) sources: copper acetate (CuAc), copper sulfate (CuS), and copper oxide (CuO); coatings containing only Ca and P (CaP) served as controls. Cu sources drove differential physical and chemical surface features of PEO coatings, resulting in tailorable release kinetics with a sustained Cu ion release over 10 weeks. The antibacterial effects of Cu-containing coatings were roughness-dependent. CuAc coating exhibited optimal properties in terms of its hydrophilicity, pores density, and limited surface roughness, which provided the most robust antibacterial activity combined with appropriate responses of human primary stem cells and angiogenic cells. Our data indicate that Cu source selection largely determines the functionality of Cu-containing PEO coatings regarding their antibacterial efficacy and cytocompatibility.

摘要

种植体早期愈合期相关感染被认为是种植体失败的主要风险因素之一。设计能够控制细菌黏附且具有细胞刺激行为的涂层仍然是牙科种植体的一项具有挑战性的策略。在这里,我们使用等离子体电解氧化 (PEO) 技术,使用生物活性元素(钙和磷)和不同的铜 (Cu) 源(醋酸铜 (CuAc)、硫酸铜 (CuS) 和氧化铜 (CuO))在商业纯钛 (cpTi) 上生产抗菌涂层;仅含有 Ca 和 P 的涂层 (CaP) 作为对照。Cu 源驱动了 PEO 涂层的不同物理和化学表面特性,从而实现了可定制的释放动力学,在 10 周内持续释放 Cu 离子。含 Cu 涂层的抗菌效果取决于其粗糙度。CuAc 涂层在亲水性、孔隙密度和有限的表面粗糙度方面表现出最佳性能,从而提供了最强大的抗菌活性,并结合了人原代干细胞和血管生成细胞的适当反应。我们的数据表明,Cu 源的选择在很大程度上决定了含 Cu 的 PEO 涂层的抗菌功效和细胞相容性的功能。

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