不同单体混合物及采用多波和单波装置光激活的光引发剂体系的牙科粘合剂的物理化学特性及其与氧化锆的粘结强度
Physical-chemical characterization and bond strength to zirconia of dental adhesives with different monomer mixtures and photoinitiator systems light-activated with poly and monowave devices.
作者信息
Fernandes Neto Constantino, Narimatsu Mayara Hana, Magão Pedro Henrique, da Costa Reginaldo Mendonça, Pfeifer Carmem Silvia, Furuse Adilson Yoshio
机构信息
Department of Operative Dentistry, Endodontics and Dental Materials, Bauru School of Dentistry, University of São Paulo, Bauru, Brazil.
Division of Biomaterials and Biomechanics, Department of Restorative Dentistry, School of Dentistry, Oregon Health and Science University, Portland, OR, USA.
出版信息
Biomater Investig Dent. 2022 Apr 28;9(1):20-32. doi: 10.1080/26415275.2022.2064289. eCollection 2022.
Bonding to crystalline zirconia is currently a challenge. Properly cured adhesives are crucial to optimize this bond, and that in turn is influenced by the initial mobility of the system, as well as by the reactivity of the initiators. This study aimed to characterize adhesives containing monomer mixtures of different viscosities and double and triple photoinitiator systems; and to evaluate the bonding to Y-TZP zirconia, when adhesives were light-activated with monowave or polywave light-curing units (LCU). Adhesives were formulated at a 1:1 weight proportion of Bis-GMA/TEGDMA or Bis-GMA/Bis-EMA. To these mixtures 0.5 wt% of CQ, 0.5-1.0 wt% of DABE, 0.5-1.0 wt% of DPIHP, or 0.5-1.0 wt% of TAS-Sb were added and used as photoinitiator systems. A total of ten adhesives were prepared. Resin composite cylinders were cemented on zirconia slices and 6000 thermal cycles were performed. Degree of conversion (DC), sorption (SO) and solubility (SL) after 7 days of water storage, and microshear bond strength (µSBS) were evaluated. Data were analyzed with three-way ANOVA and Tukey's HSD ( = 0.05). Bis-GMA/Bis-EMA combined with either CQ/DABE or CQ/DABE/TAS-Sb presented the highest DC, and no significant differences were observed for LCUs ( = .298). CQ/DABE < CQ/DABE/TAS-Sb ≈ CQ/DABE/DPIHP and the polywave LCU showed smaller overall SO ( < .05). Bis-GMA/TEGDMA with CQ/DABE cured with the polywave LCU presented the lowest SO. SL varied as follows: CQ/DABE/TAS-Sb < CQ/DABE/DPIHP < CQ/DABE ( < .001). For µSBS, only the factor photoinitiator system was significant ( = .045). All mean values were above 30 MPa, with higher values being observed for BIS-GMA/TEGDMA and CQ/DABE. It can be concluded that the adhesive containing CQ/DABE/TAS-Sb as coinitiator of Bis-GMA/Bis-EMA mixtures produced a material with higher DC and lower SL, while bond strength values were similar to the ones obtained by CQ/DABE.
与结晶氧化锆的粘结目前是一项挑战。充分固化的粘合剂对于优化这种粘结至关重要，而这又受到体系初始流动性以及引发剂反应性的影响。本研究旨在表征含有不同粘度单体混合物以及双光引发剂和三光引发剂体系的粘合剂；并评估当粘合剂用单波或多波光固化单元（LCU）进行光活化时，与Y-TZP氧化锆的粘结情况。粘合剂按照Bis-GMA/TEGDMA或Bis-GMA/Bis-EMA 1:1的重量比例配制。向这些混合物中添加0.5 wt%的CQ、0.5 - 1.0 wt%的DABE、0.5 - 1.0 wt%的DPIHP或0.5 - 1.0 wt%的TAS-Sb，并用作光引发剂体系。总共制备了十种粘合剂。将树脂复合圆柱体粘结在氧化锆切片上，并进行6000次热循环。评估了储存7天后的转化率（DC）、吸水率（SO）和溶解度（SL）以及微剪切粘结强度（µSBS）。数据采用三因素方差分析和Tukey's HSD检验（α = 0.05）进行分析。Bis-GMA/Bis-EMA与CQ/DABE或CQ/DABE/TAS-Sb组合时呈现出最高的DC，并且对于光固化单元未观察到显著差异（P = 0.298）。CQ/DABE < CQ/DABE/TAS-Sb ≈ CQ/DABE/DPIHP，并且多波光固化单元显示出总体较低的吸水率（P < 0.05）。用多波光固化单元固化的含有CQ/DABE的Bis-GMA/TEGDMA呈现出最低的吸水率。溶解度变化如下：CQ/DABE/TAS-Sb < CQ/DABE/DPIHP < CQ/DABE（P < 0.001）。对于微剪切粘结强度，只有光引发剂体系这一因素具有显著性（P = 0.045）。所有平均值均高于30 MPa，对于BIS-GMA/TEGDMA和CQ/DABE观察到更高的值。可以得出结论，含有CQ/DABE/TAS-Sb作为Bis-GMA/Bis-EMA混合物共引发剂的粘合剂产生了具有更高DC和更低SL的材料，而粘结强度值与通过CQ/DABE获得的值相似。
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