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基于仿真的超声导波在胶粘连接接头特征描述中的应用

Simulation-Based Inversion for the Characterization of Adhesively Bonded Joints Using Ultrasonic Guided Waves.

出版信息

IEEE Trans Ultrason Ferroelectr Freq Control. 2022 Jul;69(7):2400-2407. doi: 10.1109/TUFFC.2022.3175773. Epub 2022 Jun 30.

DOI:10.1109/TUFFC.2022.3175773
PMID:35580108
Abstract

Adhesively bonded structures are widely used to facilitate the manufacturing process and enhance the performance of critical components in the aerospace, automotive, and energy industries. The assessment of the bond layer using the propagation of ultrasonic guided waves has been extensively investigated in the literature using several different approaches. In this study, a finite element (FE) model was used to simulate the dispersion curves of the modes propagating in an aluminum/adhesive/aluminum bonded structure. The simulated dispersion curves were systematically compared with the experimental measurements to retrieve the shear modulus of the adhesive layer during its curing process. The optimization procedure was able to perform inversion with minimum prior knowledge of the adhesive layer properties. In general, the proposed FE-based forward model was able to match the experimental dispersion curves during curing. Notwithstanding some discrepancies observed in the early to intermediate state of curing, the predicted model parameters were in agreement within 6% of the values obtained by the reference methods. The optimal shear modulus was estimated at 1.55 GPa at the end of the curing, against a reference value of 1.47 GPa.

摘要

胶接结构被广泛应用于简化制造工艺并提高航空航天、汽车和能源工业中关键部件的性能。在文献中,已经使用了几种不同的方法对使用超声波导波传播进行的胶接层评估进行了广泛的研究。在这项研究中,使用有限元(FE)模型模拟了在铝/胶/铝胶接结构中传播的模式的频散曲线。将模拟的频散曲线与实验测量结果进行了系统比较,以在胶接层固化过程中恢复胶接层的剪切模量。优化过程能够在对胶接层性质的最小先验知识的情况下执行反演。总体而言,提出的基于 FE 的正向模型能够在固化过程中匹配实验频散曲线。尽管在固化的早期到中期观察到一些差异,但预测的模型参数与参考方法获得的值在 6%以内一致。在固化结束时,最佳剪切模量估计为 1.55 GPa,而参考值为 1.47 GPa。

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