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通过磁控溅射层间电介质用于自对准共面铟镓锌氧化物薄膜晶体管的直接n型形成工艺。

A Direct n-Formation Process by Magnetron Sputtering an Inter-Layer Dielectric for Self-Aligned Coplanar Indium Gallium Zinc Oxide Thin-Film Transistors.

作者信息

Duan Xinlv, Lu Congyan, Chuai Xichen, Chen Qian, Yang Guanhua, Geng Di

机构信息

Key Laboratory of Microelectronics Device and Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China.

University of Chinese Academy of Sciences, Beijing 100049, China.

出版信息

Micromachines (Basel). 2022 Apr 19;13(5):652. doi: 10.3390/mi13050652.

DOI:10.3390/mi13050652
PMID:35630119
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9143719/
Abstract

An inter-layer dielectric (ILD) deposition process to simultaneously form the conductive regions of self-aligned (SA) coplanar In-Ga-Zn-O (IGZO) thin-film transistors (TFTs) is demonstrated. N-IGZO regions and excellent ohmic contact can be obtained without additional steps by using a magnetron sputtering process to deposit a SiO ILD. The fabricated IGZO TFTs show a subthreshold swing (SS) of 94.16 mV/decade and a linear-region field-effect mobility () of 23.06 cm/Vs. The channel-width-normalized source/drain series resistance () extracted using the transmission line method (TLM) is approximately as low as 9.4 Ω·cm. The fabricated ring oscillator (RO) with a maximum oscillation frequency of 1.75 MHz also verifies the applicability of the TFTs.

摘要

展示了一种用于同时形成自对准(SA)共面铟镓锌氧化物(IGZO)薄膜晶体管(TFT)导电区域的层间电介质(ILD)沉积工艺。通过使用磁控溅射工艺沉积SiO ILD,无需额外步骤即可获得N型IGZO区域和优异的欧姆接触。所制备的IGZO TFT的亚阈值摆幅(SS)为94.16 mV/十倍频程,线性区场效应迁移率()为23.06 cm²/V·s。使用传输线法(TLM)提取的沟道宽度归一化源极/漏极串联电阻()约低至9.4Ω·cm。所制备的最大振荡频率为1.75 MHz的环形振荡器(RO)也验证了TFT的适用性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/333e0908e325/micromachines-13-00652-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/efb28206559f/micromachines-13-00652-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/5c61007f4e65/micromachines-13-00652-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/d5085fb2eed7/micromachines-13-00652-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/333e0908e325/micromachines-13-00652-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/efb28206559f/micromachines-13-00652-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/5c61007f4e65/micromachines-13-00652-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/d5085fb2eed7/micromachines-13-00652-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7266/9143719/333e0908e325/micromachines-13-00652-g004.jpg

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本文引用的文献

1
Study on the Lateral Carrier Diffusion and Source-Drain Series Resistance in Self-Aligned Top-Gate Coplanar InGaZnO Thin-Film Transistors.自对准顶栅共面铟镓锌氧化物薄膜晶体管中横向载流子扩散与源漏串联电阻的研究
Sci Rep. 2019 Apr 29;9(1):6588. doi: 10.1038/s41598-019-43186-7.
2
Present status of amorphous In-Ga-Zn-O thin-film transistors.非晶铟镓锌氧化物薄膜晶体管的现状
Sci Technol Adv Mater. 2010 Sep 10;11(4):044305. doi: 10.1088/1468-6996/11/4/044305. eCollection 2010 Aug.