Wang Chunxue, Zhang Daming, Ding Shuxiang, Yue Jian, Lin Hang, Zhang Xucheng, Cui Zhanchen, Shi Zuosen, Chen Changming
Opt Lett. 2022 Jun 1;47(11):2690-2693. doi: 10.1364/OL.458641.
Tunable three-dimensional (3D) integrated optical waveguide chips with optical interconnection function are beneficial to expand the application of optical devices in a 3D integrated photonic module. Here, we propose a thermo-optic (TO) tunable interlayer waveguide coupler based on the metal-printing technique. Low-loss fluorinated polycarbonate (AF-Ali-PC MA) and poly (methyl methacrylate-glycidyl methacrylate) [P(MMA-co-GMA)] are synthesized as waveguide core and cladding layer, respectively. The thermal stability and optical adsorption characteristics of AF-Ali-PC MA are analyzed. Optical signal transmission features of the interlayer coupling waveguides are simulated. The optical response properties and fabrication process flows of a dynamic multilayer waveguide chip can be greatly improved by the metal-printing technique. The on-off time of the TO interlayer coupling chip is obtained as 250 µs, and the electrical power consumption is measured as 7.6 mW. To the best of our knowledge, this is the first time that a TO tunable interlayer waveguide coupler is achieved by an efficient metal-printing method, which is suitable for large-scale photonic integrated circuit (PIC) systems and multilayer optical interconnection (OXC) networks.
具有光互连功能的可调谐三维（3D）集成光波导芯片有利于扩展光学器件在3D集成光子模块中的应用。在此，我们提出一种基于金属打印技术的热光（TO）可调谐层间波导耦合器。分别合成了低损耗氟化聚碳酸酯（AF-Ali-PC MA）和聚（甲基丙烯酸甲酯-甲基丙烯酸缩水甘油酯）[P（MMA-co-GMA）]作为波导芯层和包层。分析了AF-Ali-PC MA的热稳定性和光吸收特性。模拟了层间耦合波导的光信号传输特性。金属打印技术可大大改善动态多层波导芯片的光响应特性和制造工艺流程。测得TO层间耦合芯片的开关时间为250 µs，功耗为7.6 mW。据我们所知，这是首次通过一种高效的金属打印方法实现TO可调谐层间波导耦合器，该方法适用于大规模光子集成电路（PIC）系统和多层光互连（OXC）网络。
