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CuSn10的选择性激光熔化:力学性能、微观结构和残余应力模拟

Selective Laser Melting of CuSn10: Simulation of Mechanical Properties, Microstructure, and Residual Stresses.

作者信息

Kremer Robert, Khani Somayeh, Appel Tamara, Palkowski Heinz, Foadian Farzad

机构信息

Faculty of Mechanical Engineering, Dortmund University of Applied Sciences and Arts, Sonnenstr. 96, 44139 Dortmund, Germany.

Institute of Metallurgy, Clausthal University of Technology, Robert-Koch-Strasse 42, 38678 Clausthal-Zellerfeld, Germany.

出版信息

Materials (Basel). 2022 May 30;15(11):3902. doi: 10.3390/ma15113902.

Abstract

In this study, the evolution of mechanical properties, microstructure, and residual stresses during selective laser melting of CuSn10 components was studied. To provide a proper material model for the simulations, various CuSn10 parts were manufactured using selective laser melting and examined. The manufactured parts were also used to validate the developed model. Subsequently, a sequentially coupled thermal-mechanical FEM model was developed using the Ansys software package. The developed model was able to deliver the mechanical properties, residual stresses, and microstructure of the additively manufactured components. Due to introducing some simplifications to the model, a calibration factor was applied to adjust the simulation results. However, the developed model was validated and showed a good agreement with the experimental results, such as measured residual stresses using the hole drilling method, as well as mechanical properties of manufactured parts. Moreover, the developed material model was used to simulate the microstructure of manufactured CuSn10. A fine-grain microstructure with an average diameter of 19 ± 11 μm and preferred orientation in the Z-direction, which was the assembly direction, was obtained.

摘要

在本研究中,对CuSn10部件选择性激光熔化过程中的力学性能、微观结构和残余应力演变进行了研究。为模拟提供合适的材料模型,使用选择性激光熔化制造了各种CuSn10部件并进行检测。制造的部件还用于验证所开发的模型。随后,使用Ansys软件包开发了一个顺序耦合热-力学有限元模型。所开发的模型能够给出增材制造部件的力学性能、残余应力和微观结构。由于对模型进行了一些简化,应用了一个校准因子来调整模拟结果。然而,所开发的模型经过验证,与实验结果显示出良好的一致性,如使用钻孔法测量的残余应力以及制造部件的力学性能。此外,所开发的材料模型用于模拟制造的CuSn10的微观结构。获得了平均直径为19±11μm且在作为装配方向的Z方向上具有择优取向的细晶微观结构。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/da55/9181855/000d12c4df64/materials-15-03902-g001.jpg

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