Jabraoui Hicham, Esteve Alain, Schoenitz Mirko, Dreizin Edward L, Rossi Carole
LAAS-CNRS, University of Toulouse, 31077 Toulouse, France.
New Jersey Institute of Technology, Newark, New Jersey 07103, United States.
ACS Appl Mater Interfaces. 2022 Jun 29;14(25):29451-29461. doi: 10.1021/acsami.2c07069. Epub 2022 Jun 14.
This theoretical work aims to understand the influence of nanopores at CuO-Al nanothermite interfaces on the initial stage of thermite reaction. ReaxFF molecular dynamics simulations were run to investigate the chemical and structural evolution of the reacting interface between the fuel, Al, and oxidizer, CuO, between 400 and 900 K and considering interfaces with and without a pore. Results show that the initial alumina layer becomes enriched with Al and grows primarily into the Al metal at higher temperatures. The modification of alumina is driven by simultaneous Al and O migration between metallic Al and the native amorphous AlO layer. However, the presence of a pore significantly affects the growth kinetics and the composition of this alumina layer at temperatures exceeding 600 K, which impacts the initiation properties of the nanothermite. In the system without a pore, where Al is in direct contact with CuO, a ternary aluminate layer, a mixture of Al, O, and Cu, is formed at 800 K, which slows Al and O diffusion, thus compromising the nanothermite reactivity in fully dense Al/CuO composites. Conversely, the presence of a pore between Al and CuO promotes Al enrichment of the alumina layer above 600 K. At that temperature, any free oxygen molecules in the pore become attached to the reactive alumina surface resulting in a rapid oxygen pressure drop in the pore. This is expected to accelerate the reduction of the adjacent CuO as observed in experiments with Al/CuO composites with porosity at the CuO-Al interfaces.
这项理论研究旨在了解纳米孔在CuO-Al纳米铝热剂界面上对铝热反应初始阶段的影响。进行了ReaxFF分子动力学模拟,以研究燃料Al和氧化剂CuO之间反应界面在400至900K温度下的化学和结构演变,并考虑有无孔隙的界面情况。结果表明,初始氧化铝层在较高温度下会富集Al,并主要向Al金属中生长。氧化铝的改性是由Al和O在金属Al与原生非晶态AlO层之间的同时迁移驱动的。然而,在温度超过600K时,孔隙的存在会显著影响该氧化铝层的生长动力学和组成,进而影响纳米铝热剂的引发性能。在没有孔隙的体系中,Al与CuO直接接触,在800K时会形成三元铝酸盐层,即Al、O和Cu的混合物,这会减缓Al和O的扩散,从而降低完全致密的Al/CuO复合材料中纳米铝热剂的反应活性。相反,Al和CuO之间孔隙的存在会促进600K以上氧化铝层的Al富集。在该温度下,孔隙中的任何游离氧分子都会附着在活性氧化铝表面,导致孔隙中的氧分压迅速下降。正如在CuO-Al界面具有孔隙率的Al/CuO复合材料实验中所观察到的那样,这有望加速相邻CuO的还原。