Dielert E
Dtsch Zahnarztl Z. 1978 Aug;33(8):543-6.
It can be proved that the reliability of soldering is in practice not very high, as properties of solidity and the quality of compounds very greatly. This is unavoidable in spite of the most careful execution of the welding and observation of the corresponding soldering directions. Low sigmaB-values are attributable to: 1. the insufficient filling of the soldering space (ca. 80%); 2. many lacunae in the solder commissures, which partly communicate with one another; 3. small diffusion zones and poor wettability in case of the pairing of the materials Co-Cr-Mo/Au-solder.
可以证明，在实际中焊接的可靠性不是很高，因为牢固性和化合物质量的性质差异很大。尽管焊接操作极为仔细并遵循了相应的焊接指导，但这是不可避免的。低西格玛B值归因于：1. 焊接空间填充不足（约80%）；2. 焊料连接中存在许多间隙，部分间隙相互连通；3. 在Co-Cr-Mo/Au焊料材料配对的情况下，扩散区小且润湿性差。
