Teng Xulingjie, Tao Zhihua, Long Zhiyuan, Liu Guanting, Tao Xuefei
Department of Applied Chemistry, School of Materials and Energy, University of Electronic Science and Technology of China (UESTC) Chengdu 610054 China
Jiangxi Vocational College of Finance and Economics Jiujiang 332000 China.
RSC Adv. 2022 May 31;12(25):16153-16164. doi: 10.1039/d2ra02274e. eCollection 2022 May 23.
Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate the electrochemical behaviors of HPTT and its synergistic effect with other additives, in comparison with 1-phenyltetrazole-5-thione (PMT). GMs showed a convection-dependent interaction between PEP and HPTT. LSV and EIS tests indicated both HPTT and PMT enhanced the inhibition effect of PEP, and the synergistic effect of HPTT and PEP was stronger than that of PMT. Cross-section images illustrated the filling rate of the microvia with a 150 μm diameter and a 75 μm depth was 95.6% in 60 minutes with HPTT as the leveler. Frontier Molecular Orbitals (FMO) and Electrostatic Potential (ESP) of HPTT and PMT using quantum chemical calculations predicted the reaction sites for electrophilic and nucleophilic attack. Quantum chemical calculations suggested that HPTT is easier than PMT to bond to a copper surface and PEP.
采用含有1-(4-羟基苯基)-2-四氮唑-5-硫酮（HPTT）作为整平剂的电镀液进行微通孔铜电镀填充。进行了恒电流测量（GMs）、线性扫描伏安法（LSV）和电化学阻抗谱（EIS）测试，以研究HPTT的电化学行为及其与其他添加剂的协同效应，并与1-苯基四氮唑-5-硫酮（PMT）进行比较。GMs显示了PEP和HPTT之间对流依赖的相互作用。LSV和EIS测试表明，HPTT和PMT均增强了PEP的抑制作用，且HPTT与PEP的协同效应强于PMT。横截面图像表明，以HPTT作为整平剂时，直径为150μm、深度为75μm的微通孔在60分钟内的填充率为95.6%。使用量子化学计算对HPTT和PMT的前线分子轨道（FMO）和静电势（ESP）进行预测，确定了亲电和亲核攻击的反应位点。量子化学计算表明，HPTT比PMT更容易与铜表面和PEP结合。
