Li Jing, Zhou Guoyun, Hong Yan, Wang Chong, He Wei, Wang Shouxu, Chen Yuanming, Wen Zesheng, Wang Quanyong
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, P. R. China.
Ganzhou Sun&Lynn Circuit Co. Ltd., Ganzhou 341000, P. R. China.
ACS Omega. 2020 Mar 3;5(10):4868-4874. doi: 10.1021/acsomega.9b03691. eCollection 2020 Mar 17.
A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.
设计并合成了一种由吡咯和1,4-丁二醇二缩水甘油醚（PBDGE）组成的共聚物，作为一种整平剂，用于提高印刷电路板（PCB）通孔电镀的深镀能力。线性扫描伏安法（LSV）、恒电流测量（GMs）和循环伏安法（CV）的结果揭示了PBDGE与其他添加剂之间的强配位效应，并证实了PBDGE在有效辅助通孔电镀方面的优势性能。在通孔电镀中添加PBDGE后，深镀能力提高了35.5%。此外，通过量子化学计算和分子动力学（MD）模拟研究了反应机理，结果表明，无论通孔位置如何不同，PBDGE分子的吡咯环都会作为吸附位点吸附在铜表面上，以平衡镀铜过程。
