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电火花加工中SiCp/Al复合材料凝固过程及残余应力研究

Study on Solidification Process and Residual Stress of SiCp/Al Composites in EDM.

作者信息

Zhang Wenchao, Chang Hao, Liu Yu

机构信息

School of Mechanical Engineering and Automation, Dalian Polytechnic University, Dalian 116039, China.

Department of Mechanical Engineering, Zhengzhou Technical College, Zhengzhou 450121, China.

出版信息

Micromachines (Basel). 2022 Jun 19;13(6):972. doi: 10.3390/mi13060972.

DOI:10.3390/mi13060972
PMID:35744585
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9228367/
Abstract

To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and solid-state material transformation, and residual stress. The crack initiated by the thermal stress in the recast layer was investigated, and a mathematical model of crack tip stress was proposed. The results showed a wide range of residual stresses from 44 MPa to 404 MPa. The model is validated using experimental data with three points on the surface layer.

摘要

为研究SiCp/Al复合材料在加热和凝固过程中残余应力的变化，提出了一种用于熔融材料凝固过程的单向流固耦合（FSI）模型。该模型利用工艺参数来获取温度分布、液态和固态材料转变以及残余应力。研究了重熔层中热应力引发的裂纹，并提出了裂纹尖端应力的数学模型。结果表明残余应力范围很广，从44MPa到404MPa。该模型通过表层上三个点的实验数据进行了验证。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/16c9e90d65cb/micromachines-13-00972-g018.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/19c604ae3ad6/micromachines-13-00972-g017.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/16c9e90d65cb/micromachines-13-00972-g018.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/7bf539f4f9a0/micromachines-13-00972-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/5e9f1b1c5a75/micromachines-13-00972-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/434cb9960ba7/micromachines-13-00972-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/b8bef1298838/micromachines-13-00972-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/f998ae6bce26/micromachines-13-00972-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/c7c6b2bc8805/micromachines-13-00972-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/d4e34f91855e/micromachines-13-00972-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/0ad38a1a074a/micromachines-13-00972-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/0c4526734a24/micromachines-13-00972-g014.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7744/9228367/16c9e90d65cb/micromachines-13-00972-g018.jpg

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