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采用脱合金化成型和溶液浸渍法在铜基体上构建超疏水表面。

Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method.

作者信息

Li Hui, Sun Yannan, Wang Zhe, Wang Shiyi

机构信息

Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Nanhai Ave 3688, Shenzhen 518060, China.

出版信息

Materials (Basel). 2022 Jul 10;15(14):4816. doi: 10.3390/ma15144816.

DOI:10.3390/ma15144816
PMID:35888283
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9322487/
Abstract

In this study, a superhydrophobic surface was constructed on a copper substrate through dealloying-forming and solution-immersion methods. The dealloying process for nanostructures on a copper surface involved the electrodeposition of zinc atoms, and the thermal alloying and chemical dealloying of zinc atoms. Then, a dealloyed copper surface was subsequently modified with low-surface-energy copper stearate to produce a superhydrophobic surface. Scanning electron microscopy, X-ray diffractometry, and Fourier transform infrared spectrometry were employed to characterize the morphological features and composition components of the surface in the fabrication process. The static contact angles of the copper surfaces were compared and evaluated based on various fabrication parameters, including electric current density, corrosive solution concentration, and nanostructures. The results indicated that a leaf-like copper stearate could be constructed through immersing a dealloyed copper plate into a 0.005 mol/L ethanol solution of stearic acid for 5 min. Nanostructures provided more attachment areas on the copper surface to facilitate the formation of copper stearate. The resulting as-prepared surface presented excellent superhydrophobic properties with a contact angle of over 156.5°, and showed the potential properties of non-sticking, self-cleaning, anti-corrosion, and stability. This study provides an efficient approach to fabricate superhydrophobic surfaces for engineering copper metals.

摘要

在本研究中,通过脱合金成型和溶液浸渍法在铜基底上构建了超疏水表面。铜表面纳米结构的脱合金过程包括锌原子的电沉积、锌原子的热合金化和化学脱合金。然后,用低表面能的硬脂酸铜对脱合金后的铜表面进行改性,以制备超疏水表面。采用扫描电子显微镜、X射线衍射仪和傅里叶变换红外光谱仪对制备过程中表面的形态特征和组成成分进行表征。基于电流密度、腐蚀溶液浓度和纳米结构等各种制备参数,对铜表面的静态接触角进行了比较和评估。结果表明,将脱合金后的铜板浸入0.005 mol/L的硬脂酸乙醇溶液中5分钟,可以构建出叶状的硬脂酸铜。纳米结构在铜表面提供了更多的附着区域,有利于硬脂酸铜的形成。所制备的表面呈现出优异的超疏水性能,接触角超过156.5°,并具有不粘、自清洁、耐腐蚀和稳定性等潜在特性。本研究为工程铜金属制备超疏水表面提供了一种有效的方法。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/d735dc1f2962/materials-15-04816-g014.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c967e4c404d0/materials-15-04816-g001.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/77f3b60ae5fe/materials-15-04816-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c9ae8bdb7e6f/materials-15-04816-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/32f80f684da7/materials-15-04816-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/4f4ab8ab6e89/materials-15-04816-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/120b8f4a2f8a/materials-15-04816-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c65dc8cc46dd/materials-15-04816-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/0d5437619f75/materials-15-04816-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/d735dc1f2962/materials-15-04816-g014.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c967e4c404d0/materials-15-04816-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/5a0ecb55cd29/materials-15-04816-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/2630aa95fdfd/materials-15-04816-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/954a1204f593/materials-15-04816-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/d055740055f3/materials-15-04816-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/96e5135feef5/materials-15-04816-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/77f3b60ae5fe/materials-15-04816-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c9ae8bdb7e6f/materials-15-04816-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/32f80f684da7/materials-15-04816-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/4f4ab8ab6e89/materials-15-04816-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/120b8f4a2f8a/materials-15-04816-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/c65dc8cc46dd/materials-15-04816-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/0d5437619f75/materials-15-04816-g013.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/668a/9322487/d735dc1f2962/materials-15-04816-g014.jpg

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